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GuruFocus Financial Strength Rank measures how strong a company’s financial situation is. It is based on these factors

1. The debt burden that the company has as measured by its Interest coverage (current year).
2. Debt to revenue ratio. The lower, the better
3. Altman Z-score.

A company ranks high with financial strength is likely to withstand any business slowdowns and recessions.

Financial Strength : 7/10

vs
industry
vs
history
Cash to Debt 26.75
BESIY's Cash to Debt is ranked higher than
70% of the 1013 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: 4.92 vs. BESIY: 26.75 )
BESIY' s 10-Year Cash to Debt Range
Min: 0.71   Max: No Debt
Current: 26.75

Equity to Asset 0.75
BESIY's Equity to Asset is ranked higher than
76% of the 1005 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: 0.65 vs. BESIY: 0.75 )
BESIY' s 10-Year Equity to Asset Range
Min: 0.58   Max: 0.84
Current: 0.75

0.58
0.84
F-Score: 5
Z-Score: 4.34
M-Score: -2.60
GuruFocus Profitability Rank ranks how profitable a company is and how likely the company’s business will stay that way. It is based on these factors:

1. Operating Margin
2. Trend of the Operating Margin (5-year average). The company with an uptrend profit margin has a higher rank.
••3. Consistency of the profitability
4. Piotroski F-Score
5. Predictability Rank•

The maximum rank is 10. A rank of 7 or higher means a higher profitability and may stay that way. A rank of 3 or lower indicates that the company has had trouble to make a profit.

Profitability Rank is not directly related to the Financial Strength Rank. But if a company is consistently profitable, its financial strength will be stronger.

Profitability & Growth : 5/10

vs
industry
vs
history
Operating margin (%) 7.60
BESIY's Operating margin (%) is ranked higher than
78% of the 989 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: 2.37 vs. BESIY: 7.60 )
BESIY' s 10-Year Operating margin (%) Range
Min: -22.99   Max: 14.34
Current: 7.6

-22.99
14.34
Net-margin (%) 5.69
BESIY's Net-margin (%) is ranked higher than
74% of the 989 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: 1.59 vs. BESIY: 5.69 )
BESIY' s 10-Year Net-margin (%) Range
Min: -22.95   Max: 9.33
Current: 5.69

-22.95
9.33
ROE (%) 5.88
BESIY's ROE (%) is ranked higher than
72% of the 984 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: 2.33 vs. BESIY: 5.88 )
BESIY' s 10-Year ROE (%) Range
Min: -23.5   Max: 10.2
Current: 5.88

-23.5
10.2
ROA (%) 4.29
BESIY's ROA (%) is ranked higher than
75% of the 998 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: 1.20 vs. BESIY: 4.29 )
BESIY' s 10-Year ROA (%) Range
Min: -14.12   Max: 7.51
Current: 4.29

-14.12
7.51
ROC (Joel Greenblatt) (%) 26.18
BESIY's ROC (Joel Greenblatt) (%) is ranked higher than
85% of the 998 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: 4.03 vs. BESIY: 26.18 )
BESIY' s 10-Year ROC (Joel Greenblatt) (%) Range
Min: -39.61   Max: 43.93
Current: 26.18

-39.61
43.93
Revenue Growth (%) 18.10
BESIY's Revenue Growth (%) is ranked higher than
92% of the 705 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: -0.60 vs. BESIY: 18.10 )
BESIY' s 10-Year Revenue Growth (%) Range
Min: -100   Max: 23.7
Current: 18.1

-100
23.7
EBITDA Growth (%) 15.80
BESIY's EBITDA Growth (%) is ranked higher than
86% of the 471 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: -4.80 vs. BESIY: 15.80 )
BESIY' s 10-Year EBITDA Growth (%) Range
Min: 0   Max: 27.1
Current: 15.8

0
27.1
EPS Growth (%) 37.90
BESIY's EPS Growth (%) is ranked higher than
91% of the 412 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: -4.00 vs. BESIY: 37.90 )
BESIY' s 10-Year EPS Growth (%) Range
Min: -49.4   Max: 152
Current: 37.9

-49.4
152
» BESIY's 10-Y Financials

Financials


Revenue & Net Income
Cash & Debt
Oprt. Cash Flow & Free Cash Flow

» Details

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Ratios

vs
industry
vs
history
P/E(ttm) 26.70
BESIY's P/E(ttm) is ranked higher than
51% of the 578 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: 24.80 vs. BESIY: 26.70 )
BESIY' s 10-Year P/E(ttm) Range
Min: 2.9   Max: 52.83
Current: 26.7

2.9
52.83
P/B 1.60
BESIY's P/B is ranked higher than
62% of the 982 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: 1.79 vs. BESIY: 1.60 )
BESIY' s 10-Year P/B Range
Min: 0.24   Max: 1.62
Current: 1.6

0.24
1.62
P/S 1.67
BESIY's P/S is ranked higher than
53% of the 1019 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: 1.65 vs. BESIY: 1.67 )
BESIY' s 10-Year P/S Range
Min: 0.29   Max: 3.75
Current: 1.67

0.29
3.75
PFCF 18.30
BESIY's PFCF is ranked higher than
59% of the 525 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: 20.00 vs. BESIY: 18.30 )
BESIY' s 10-Year PFCF Range
Min: 3.82   Max: 174.33
Current: 18.3

3.82
174.33
EV-to-EBIT 26.30
BESIY's EV-to-EBIT is ranked lower than
56% of the 698 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: 20.80 vs. BESIY: 26.30 )
BESIY' s 10-Year EV-to-EBIT Range
Min: 2.1   Max: 27.3
Current: 26.3

2.1
27.3
Shiller P/E 17.40
BESIY's Shiller P/E is ranked higher than
84% of the 277 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: 29.58 vs. BESIY: 17.40 )
BESIY' s 10-Year Shiller P/E Range
Min: 9.28   Max: 73.94
Current: 17.4

9.28
73.94

Dividend & Buy Back

vs
industry
vs
history
Dividend Yield 1.55
BESIY's Dividend Yield is ranked higher than
65% of the 474 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: 1.59 vs. BESIY: 1.55 )
BESIY' s 10-Year Dividend Yield Range
Min: 2.82   Max: 4.23
Current: 1.55

2.82
4.23
Dividend Payout 0.44
BESIY's Dividend Payout is ranked higher than
53% of the 345 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: 0.38 vs. BESIY: 0.44 )
BESIY' s 10-Year Dividend Payout Range
Min: 0.68   Max: 1.49
Current: 0.44

0.68
1.49
Yield on cost (5-Year) 1.60
BESIY's Yield on cost (5-Year) is ranked higher than
61% of the 516 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: 1.79 vs. BESIY: 1.60 )
BESIY' s 10-Year Yield on cost (5-Year) Range
Min: 2.82   Max: 4.23
Current: 1.6

2.82
4.23
Share Buyback Rate -3.90
BESIY's Share Buyback Rate is ranked higher than
68% of the 561 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: -1.50 vs. BESIY: -3.90 )
BESIY' s 10-Year Share Buyback Rate Range
Min: 7.3   Max: -10.7
Current: -3.9

Valuation & Return

vs
industry
vs
history
Price/Net Current Asset Value 16.70
BESIY's Price/Net Current Asset Value is ranked lower than
72% of the 481 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: 7.00 vs. BESIY: 16.70 )
BESIY' s 10-Year Price/Net Current Asset Value Range
Min: 0.92   Max: 85
Current: 16.7

0.92
85
Price/Tangible Book 2.30
BESIY's Price/Tangible Book is ranked higher than
51% of the 969 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: 2.00 vs. BESIY: 2.30 )
BESIY' s 10-Year Price/Tangible Book Range
Min: 0.59   Max: 4.1
Current: 2.3

0.59
4.1
Price/DCF (Projected) 1.60
BESIY's Price/DCF (Projected) is ranked higher than
63% of the 374 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: 1.50 vs. BESIY: 1.60 )
BESIY' s 10-Year Price/DCF (Projected) Range
Min: 0.56   Max: 5.52
Current: 1.6

0.56
5.52
Price/Median PS Value 1.90
BESIY's Price/Median PS Value is ranked lower than
74% of the 952 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: 1.10 vs. BESIY: 1.90 )
BESIY' s 10-Year Price/Median PS Value Range
Min: 0.65   Max: 4.12
Current: 1.9

0.65
4.12
Price/Peter Lynch Fair Value 1.10
BESIY's Price/Peter Lynch Fair Value is ranked higher than
70% of the 117 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: 1.70 vs. BESIY: 1.10 )
BESIY' s 10-Year Price/Peter Lynch Fair Value Range
Min: 0.15   Max: 1.38
Current: 1.1

0.15
1.38
Price/Graham Number 1.70
BESIY's Price/Graham Number is ranked higher than
56% of the 583 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: 1.60 vs. BESIY: 1.70 )
BESIY' s 10-Year Price/Graham Number Range
Min: 0.46   Max: 4.24
Current: 1.7

0.46
4.24
Earnings Yield (Greenblatt) 3.80
BESIY's Earnings Yield (Greenblatt) is ranked lower than
51% of the 750 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: 4.60 vs. BESIY: 3.80 )
BESIY' s 10-Year Earnings Yield (Greenblatt) Range
Min: 3.7   Max: 46.6
Current: 3.8

3.7
46.6
Forward Rate of Return (Yacktman) 0.07
BESIY's Forward Rate of Return (Yacktman) is ranked higher than
70% of the 572 Companies
in the Global Semiconductor Equipment & Materials industry.

( Industry Median: 1.20 vs. BESIY: 0.07 )
BESIY' s 10-Year Forward Rate of Return (Yacktman) Range
Min: -10.6   Max: 2.2
Current: 0.07

-10.6
2.2

Business Description

Industry: Semiconductors » Semiconductor Equipment & Materials
Compare: » details
Traded in other countries:BESI.Netherlands, BSIB.Germany
BE Semiconductor Industries NV, is engaged in one line of business, the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. The company develops assembly processes and equipment for Leadframe, Array Connect and Wafer Level Packaging applications for electronics, computer, automotive, industrial, RFID, LED and solar energy industries. Its customers are semiconductor manufacturers, assembly subcontractors and electronics and industrial companies. The company's product offerings include: Die attach equipment: from which it produces single, multi-chip and flip chip die bonding systems and die sorting systems; Packaging equipment: from which it produces molding, trim and form and singulation systems; Plating equipment: from which it produces tin, copper and precious metal plating systems; Wire bonding equipment: from which it produces systems utilizing gold and copper wire for sale in combination with its die attach systems and provide services to its installed base of customers; and Services: for which it provides tooling, conversion kits and spare parts to its customers worldwide. The company's equipment is used by customers to produce advanced semiconductor assemblies or packages. Such assemblies provide the electronic interface and physical connection between a semiconductor device, or chip and other electronic components and protect the chip from the external environment. The company operates seven facilities comprising of approximately 490,000 square feet of space for production and development activities as well as approximately nine sales and service offices across Europe, Asia and North America.
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