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Taiwan Semiconductor Manufacturing Co Ltd (NYSE:TSM)
Additional Paid-In Capital
$1,871 Mil (As of Jun. 2014)

Taiwan Semiconductor Manufacturing Co Ltd's quarterly additional paid-in capital declined from Dec. 2013 ($1,854 Mil) to Mar. 2014 ($1,849 Mil) but then increased from Mar. 2014 ($1,849 Mil) to Jun. 2014 ($1,871 Mil).

Taiwan Semiconductor Manufacturing Co Ltd's annual additional paid-in capital increased from Dec. 2011 ($1,862 Mil) to Dec. 2012 ($1,913 Mil) but then declined from Dec. 2012 ($1,913 Mil) to Dec. 2013 ($1,854 Mil).


Capital that a company raises in a financing round in excess of the capital's par value. The account represents the excess paid by an investor over the par-value price of a stock issue. Additional paid-in-capital can arise from issuing either preferred or common stock.

Additional Paid-In Capital is calculated as

Additional Paid-In Capital=(Issue Price-Par Value)*Shares Outstanding

Related Terms

Shares Outstanding

Historical Data

* All numbers are in millions except for per share data and ratio. All numbers are in their own currency.

Taiwan Semiconductor Manufacturing Co Ltd Annual Data

AdditionalPaidInCapital 1,7791,7881,6431,6611,4951,7411,9131,8621,9131,854

Taiwan Semiconductor Manufacturing Co Ltd Quarterly Data

AdditionalPaidInCapital 1,9021,8691,9021,9131,8701,8651,9011,8541,8491,871
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