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Taiwan Semiconductor Manufacturing Co Ltd (NYSE:TSM)
Additional Paid-In Capital
$1,857 Mil (As of Sep. 2014)

Taiwan Semiconductor Manufacturing Co Ltd's quarterly additional paid-in capital increased from Mar. 2014 ($1,837 Mil) to Jun. 2014 ($1,868 Mil) but then declined from Jun. 2014 ($1,868 Mil) to Sep. 2014 ($1,857 Mil).

Taiwan Semiconductor Manufacturing Co Ltd's annual additional paid-in capital increased from Dec. 2011 ($1,846 Mil) to Dec. 2012 ($1,917 Mil) but then declined from Dec. 2012 ($1,917 Mil) to Dec. 2013 ($1,879 Mil).


Definition

Capital that a company raises in a financing round in excess of the capital's par value. The account represents the excess paid by an investor over the par-value price of a stock issue. Additional paid-in-capital can arise from issuing either preferred or common stock.

Additional Paid-In Capital is calculated as

Additional Paid-In Capital=(Issue Price-Par Value)*Shares Outstanding

Related Terms

Shares Outstanding


Historical Data

* All numbers are in millions except for per share data and ratio. All numbers are in their own currency.

Taiwan Semiconductor Manufacturing Co Ltd Annual Data

Dec04Dec05Dec06Dec07Dec08Dec09Dec10Dec11Dec12Dec13
AdditionalPaidInCapital 1,7611,7211,6561,6581,5041,7211,8631,8461,9171,879

Taiwan Semiconductor Manufacturing Co Ltd Quarterly Data

Jun12Sep12Dec12Mar13Jun13Sep13Dec13Mar14Jun14Sep14
AdditionalPaidInCapital 1,8731,8871,9171,8751,8651,8851,8791,8371,8681,857
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