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Taiwan Semiconductor Manufacturing Co Ltd (NYSE:TSM)
Additional Paid-In Capital
$1,723 Mil (As of Sep. 2015)

Taiwan Semiconductor Manufacturing Co Ltd's quarterly additional paid-in capital increased from Mar. 2015 ($1,790 Mil) to Jun. 2015 ($1,830 Mil) but then declined from Jun. 2015 ($1,830 Mil) to Sep. 2015 ($1,723 Mil).

Taiwan Semiconductor Manufacturing Co Ltd's annual additional paid-in capital declined from Dec. 2012 ($1,933 Mil) to Dec. 2013 ($1,879 Mil) and declined from Dec. 2013 ($1,879 Mil) to Dec. 2014 ($1,785 Mil).


Capital that a company raises in a financing round in excess of the capital's par value. The account represents the excess paid by an investor over the par-value price of a stock issue. Additional paid-in-capital can arise from issuing either preferred or common stock.

Additional Paid-In Capital is calculated as

Additional Paid-In Capital=(Issue Price-Par Value)*Shares Outstanding

Related Terms

Shares Outstanding

Historical Data

* All numbers are in millions except for per share data and ratio. All numbers are in their own currency.

Taiwan Semiconductor Manufacturing Co Ltd Annual Data

AdditionalPaidInCapital 1,6561,6581,5041,7211,8631,8461,9331,8791,7851,717

Taiwan Semiconductor Manufacturing Co Ltd Quarterly Data

AdditionalPaidInCapital 1,8851,8791,8371,8681,8571,7851,7901,8301,7231,717
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