Cadence Collaborates with TSMC to Accelerate Mobile, AI and Hyperscale Computing Application Development on N3 and N4 Processes

Author's Avatar
May 27, 2021

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is expanding its collaboration with TSMC to accelerate mobile, AI and hyperscale computing application design using the integrated Cadence® digital flow and custom/analog tool suite on TSMC’s N3 and N4 process technologies. Joint Cadence and TSMC customers have already successfully used the digital and custom/analog tools to complete test chip tapeouts. As part of the collaboration, the Cadence digital and custom/analog tools have been optimized and certified for TSMC’s N3 and N4 process technologies, supporting the latest Design Rule Manual (DRM) certification and SPICE correlation. The corresponding N3 and N4 process design kit (PDKs) are available now.