- Advanced Semiconductor Engineering, Inc. (ASE) launches FOCoS-Bridge with TSV for improved AI and HPC applications.
- The new technology reduces power loss threefold and enhances energy efficiency.
- ASE aims to support AI ecosystem demands with high-density, sustainable computing solutions.
Advanced Semiconductor Engineering, Inc. (ASE), a subsidiary of ASE Technology Holding Co., Ltd. (ASX, Financial), has unveiled its latest technological advancement, the Fan-Out Chip-on-Substrate-Bridge (FOCoS-Bridge) with Through Silicon Via (TSV). This innovation is designed to significantly boost the performance and efficiency of artificial intelligence (AI) and high-performance computing (HPC) applications by reducing power loss by a factor of three.
The FOCoS-Bridge with TSV meets the increasing global demand for greater bandwidth and more efficient power delivery, crucial in contemporary AI and HPC contexts. By integrating TSV, ASE's technology enhances the VIPackâ„¢ platform, providing higher input/output (I/O) density, improved thermal dissipation, and critical energy efficiencies.
Future AI and HPC applications increasingly require advanced integration solutions with higher interconnection densities. ASE's strategic focus is reflected in the FOCoS-Bridge platform, which supports chiplet integration and meets complex power delivery needs with advanced TSV bridge chip features. The platform has already demonstrated its capabilities using an 85mm x 85mm test vehicle comprising two fan-out modules integrating one ASIC chip and four HBM3 chips interconnected by four TSV bridge chips.
The introduction of FOCoS-Bridge with TSV underscores ASE's commitment to advanced heterogeneous integration solutions, optimizing high-performance computing architectures. ASE will showcase these technologies at the ECTC 2025 conference in Dallas, further reinforcing its position as a leader in the semiconductor industry.
