- Smartkem (SMTK, Financial) enters a preliminary Joint Development Agreement with Manz Asia for AI chip packaging.
- The partnership aims to improve yield, cost efficiency, and chip density for data center applications.
- Focus on developing next-generation dielectric ink solutions for advanced semiconductor packaging.
Smartkem (NASDAQ: SMTK), a leader in semiconductor technology, has announced a preliminary Joint Development Agreement (JDA) with Manz Asia to co-develop next-generation dielectric ink solutions tailored for advanced AI chip packaging applications. This initiative builds upon their existing collaboration, which previously demonstrated an advanced inkjet metalization process for chip packaging during SEMICON® SEA 2025.
The collaboration aims to blend Smartkem's semiconductor materials with Manz's precision inkjet technology. The focus is to develop solutions that will cater to both 12" wafer-level packaging and extend to large-area panel packaging. These advancements are expected to enhance chip density, speed up interconnections, and improve thermal management, making them particularly beneficial for data centers deploying numerous AI accelerators.
The joint effort could lead to significant manufacturing advantages by delivering higher yields and lowering the cost per packaged chip. However, it is important to note that the agreement is preliminary and non-binding, with no definitive timeline or financial terms disclosed. The outcome of further developments and market adoption remains to be seen.
Smartkem and Manz Asia believe this collaboration could reshape the AI hardware landscape, offering a transformative manufacturing path that is more sustainable and efficient. The partnership leverages Manz Asia's engineering excellence in semiconductor manufacturing equipment and Smartkem's expertise in advanced semiconductor materials. The ongoing efforts are geared towards creating scalable, high-performance solutions that address critical challenges in advanced chip packaging.
