JCET Group Co (SHSE:600584) Accounts Payable

: ¥5,005 Mil (As of Dec. 2023)

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JCET Group Co's Accounts Payable for the quarter that ended in Dec. 2023 was ¥5,005 Mil.

JCET Group Co's quarterly Accounts Payable increased from Jun. 2023 (¥4,818 Mil) to Sep. 2023 (¥6,437 Mil) but then declined from Sep. 2023 (¥6,437 Mil) to Dec. 2023 (¥5,005 Mil).

JCET Group Co's annual Accounts Payable declined from Dec. 2021 (¥5,877 Mil) to Dec. 2022 (¥4,973 Mil) but then increased from Dec. 2022 (¥4,973 Mil) to Dec. 2023 (¥5,005 Mil).

JCET Group Co Accounts Payable Historical Data

The historical data trend for JCET Group Co's Accounts Payable can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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JCET Group Co Annual Data

Trend

Dec14

Dec15

Dec16

Dec17

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

Accounts Payable

5,575.85

5,012.24

5,877.44

4,972.95

5,005.25

JCET Group Co Quarterly Data
	Mar19	Jun19	Sep19	Dec19	Mar20	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23
Accounts Payable																4,972.95	3,784.95	4,817.64	6,436.52	5,005.25

JCET Group Co Accounts Payable Calculation

Accounts Payable represents any money that a company owes its suppliers for goods and services purchased on credit and is expected to pay within the next year or operating cycle.

JCET Group Co Accounts Payable Related Terms

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JCET Group Co (SHSE:600584) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » JCET Group Co Ltd (SHSE:600584) » Definitions » Accounts Payable

Comparable Companies

Traded in Other Exchanges

N/A

Address

No. 99, Chengjiang East Road, Jiangsu Province, Jiangyin, CHN, 214431

Website

http://www.cj-elec.com

JCET Group Co Ltd is engaged in providing packaging design, product development, and certification, with a range of services including semiconductor design, wafer probe, bump, packaging, test and drop shipment. The company has a portfolio of technology and solutions, including the intellectual property (IP) rights of Fan-out embedded Wafer Level Ball Grid Array (eWLB), wafer level chip scale packaging (WLCSP), wafer bump, Package-on-Package (PoP), flip chip Ball Grid Array (fcBGA) and System-in-Package (SiP).

JCET Group Co (SHSE:600584) Headlines

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