XinTec (ROCO:3374) Other Financing : NT$-818 Mil (TTM As of Dec. 2023)

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What is XinTec Other Financing?

XinTec's Other Financing for the three months ended in Dec. 2023 was NT$-1 Mil.

XinTec's Other Financing for the trailing twelve months (TTM) ended in Dec. 2023 was NT$-818 Mil.

XinTec Other Financing Historical Data

The historical data trend for XinTec's Other Financing can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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XinTec Other Financing Chart

XinTec Annual Data

Trend

Dec14

Dec15

Dec16

Dec17

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

Other Financing

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-30.69

-20.37

-4.94

-3.80

-3.47

XinTec Quarterly Data
	Mar19	Jun19	Sep19	Dec19	Mar20	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23
Other Financing	Get a 7-Day Free Trial															-0.95	-0.81	-0.87	-814.93	-0.95

XinTec Other Financing Calculation

Other Financing represents other cash flow from financing activity that not otherwise classified, which includes:
Proceeds From Stock Option Exercised
Other Financing Charges

Other Financing for the trailing twelve months (TTM) ended in Dec. 2023 adds up the quarterly data reported by the company within the most recent 12 months, which was NT$-818 Mil.

XinTec Other Financing Related Terms

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XinTec (ROCO:3374) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » XinTec Inc (ROCO:3374) » Definitions » Other Financing

Comparable Companies

Traded in Other Exchanges

N/A

Address

Number 23, Jilin Road, 9th Floor, Jhongli Industrial Park, Jhongli District, Taoyuan, TWN, 32062

Website

https://www.xintec.com.tw

XinTec Inc is a subcontractor of packaging services in the semiconductor industry which includes wafer level chip scale packaging and wafer level post passivation interconnection services.

XinTec (ROCO:3374) Headlines

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