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Towa (TSE:6315) Short-Term Debt

: 円11,140 Mil (As of Dec. 2023)
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Towa's Short-Term Debt for the quarter that ended in Dec. 2023 was 円11,140 Mil.

Towa's quarterly Short-Term Debt increased from Jun. 2023 (円11,270 Mil) to Sep. 2023 (円11,710 Mil) but then declined from Sep. 2023 (円11,710 Mil) to Dec. 2023 (円11,140 Mil).

Towa's annual Short-Term Debt increased from Mar. 2021 (円2,840 Mil) to Mar. 2022 (円6,640 Mil) and increased from Mar. 2022 (円6,640 Mil) to Mar. 2023 (円11,330 Mil).


Towa Short-Term Debt Historical Data

The historical data trend for Towa's Short-Term Debt can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Towa Annual Data
Trend Mar14 Mar15 Mar16 Mar17 Mar18 Mar19 Mar20 Mar21 Mar22 Mar23
Short-Term Debt
Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 6,410.00 4,936.88 2,840.00 6,640.00 11,330.00

Towa Quarterly Data
Mar19 Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23
Short-Term Debt Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 10,140.00 11,330.00 11,270.00 11,710.00 11,140.00

Towa Short-Term Debt Explanation

Short-Term Debt represents the total amount of Long-Term Debt such as bank loans and commercial paper, which is due within one year.


Towa Short-Term Debt Related Terms

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Towa (TSE:6315) Business Description

Traded in Other Exchanges
Address
5 Kamichoshi-cho, Kamitoba, Minami-ku, Kyoto, JPN, 601-8105
Towa Corp develops, manufactures and sells resin encapsulation systems for semiconductors and singulation systems. In addition, it also manufactures and sells precision molds for manufacturing semiconductors and plastic molded products. Its product portfolio is divided into two technologies molding including light-emitting diode, semiconductor, and sensors/module products and Singulation including semiconductor, and light-emitting diode-other applications. The company's segments include semiconductor equipment and fine plastic mold. The majority of the company revenue is derived from the sale of semiconductor equipment.

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