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Okins Electronics Co (XKRX:080580) Debt-to-EBITDA : 6.56 (As of Sep. 2024)


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What is Okins Electronics Co Debt-to-EBITDA?

Debt-to-EBITDA measures a company's ability to pay off its debt.

Okins Electronics Co's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Sep. 2024 was ₩37,281 Mil. Okins Electronics Co's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Sep. 2024 was ₩8,079 Mil. Okins Electronics Co's annualized EBITDA for the quarter that ended in Sep. 2024 was ₩6,912 Mil. Okins Electronics Co's annualized Debt-to-EBITDA for the quarter that ended in Sep. 2024 was 6.56.

A high Debt-to-EBITDA ratio generally means that a company may spend more time to paying off its debt. According to Joel Tillinghast's BIG MONEY THINKS SMALL: Biases, Blind Spots, and Smarter Investing, a ratio of Debt-to-EBITDA exceeding four is usually considered scary unless tangible assets cover the debt.

The historical rank and industry rank for Okins Electronics Co's Debt-to-EBITDA or its related term are showing as below:

XKRX:080580' s Debt-to-EBITDA Range Over the Past 10 Years
Min: -24.3   Med: 3.2   Max: 5.34
Current: 3.6

During the past 11 years, the highest Debt-to-EBITDA Ratio of Okins Electronics Co was 5.34. The lowest was -24.30. And the median was 3.20.

XKRX:080580's Debt-to-EBITDA is ranked worse than
69.94% of 702 companies
in the Semiconductors industry
Industry Median: 1.565 vs XKRX:080580: 3.60

Okins Electronics Co Debt-to-EBITDA Historical Data

The historical data trend for Okins Electronics Co's Debt-to-EBITDA can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Okins Electronics Co Debt-to-EBITDA Chart

Okins Electronics Co Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Debt-to-EBITDA
Get a 7-Day Free Trial Premium Member Only Premium Member Only 3.16 2.86 3.24 3.51 3.57

Okins Electronics Co Quarterly Data
Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24 Sep24
Debt-to-EBITDA Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 4.51 2.13 3.98 4.15 6.56

Competitive Comparison of Okins Electronics Co's Debt-to-EBITDA

For the Semiconductor Equipment & Materials subindustry, Okins Electronics Co's Debt-to-EBITDA, along with its competitors' market caps and Debt-to-EBITDA data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Okins Electronics Co's Debt-to-EBITDA Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, Okins Electronics Co's Debt-to-EBITDA distribution charts can be found below:

* The bar in red indicates where Okins Electronics Co's Debt-to-EBITDA falls into.



Okins Electronics Co Debt-to-EBITDA Calculation

Debt-to-EBITDA measures a company's ability to pay off its debt.

Okins Electronics Co's Debt-to-EBITDA for the fiscal year that ended in Dec. 2023 is calculated as

Debt-to-EBITDA=Total Debt / EBITDA
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / EBITDA
=(22330.637 + 22524.782) / 12577.829
=3.57

Okins Electronics Co's annualized Debt-to-EBITDA for the quarter that ended in Sep. 2024 is calculated as

Debt-to-EBITDA=Total Debt / EBITDA
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / EBITDA
=(37280.738 + 8079.286) / 6911.528
=6.56

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

In the calculation of annual Debt-to-EBITDA, the EBITDA of the last fiscal year is used. In calculating the annualized quarterly data, the EBITDA data used here is four times the quarterly (Sep. 2024) EBITDA data.


Okins Electronics Co  (XKRX:080580) Debt-to-EBITDA Explanation

In the calculation of Debt-to-EBITDA, we use the total of Short-Term Debt & Capital Lease Obligation and Long-Term Debt & Capital Lease Obligation divided by EBITDA. In some calculations, Total Liabilities is used to for calculation.


Be Aware

A high Debt-to-EBITDA ratio generally means that a company may spend more time to paying off its debt.

According to Joel Tillinghast's BIG MONEY THINKS SMALL: Biases, Blind Spots, and Smarter Investing, a ratio of Debt-to-EBITDA exceeding four is usually considered scary unless tangible assets cover the debt.


Okins Electronics Co Debt-to-EBITDA Related Terms

Thank you for viewing the detailed overview of Okins Electronics Co's Debt-to-EBITDA provided by GuruFocus.com. Please click on the following links to see related term pages.


Okins Electronics Co Business Description

Traded in Other Exchanges
N/A
Address
13, Ojeongongeop-gil, 5th Floor, Gyeonggi-do, Uiwang-si, KOR, 16072
Okins Electronics Co Ltd is a supplier of the device interface system. The company manufactures BiTS products for the applications to support device contacts for both memory and logic products. The business units of the organization include BiTS BU, Semiconductor BU and MEMS BU. The product line of the BiTS BU includes burn-in socket, test socket, memory module test socket, SSD module socket, spring probes and PION. Its semiconductor test service offers IC testing services for fabless design houses on test development and volume operation of wafer probing and package testing. The MEMS division is a solution-oriented department for manufacturing sockets for testing fine pitch packages.

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