What is Micropac Industries Probability of Financial Distress (%)?
Probability of Financial Distress (%) measures the probability that a company will go bankrupt in the upcoming year given its current financial position. A higher ratio indicates a larger probability of bankruptcy for the company, while a lower ratio indicates a healthier fundamental. As of today, Micropac Industries's Probability of Financial Distress (%) is 0.03%.
Like the Altman Z-Score, the PFD measures a company's bankruptcy risk. However, the main drawback of the Z-score is it does not apply to banks and insurance companies. According to Investopedia, the concept of "working capital" does not apply to banks and insurance companies, as financial institutions do not have typical current assets or current liabilities like inventories or accounts payable.
Competitive Comparison of Micropac Industries's Probability of Financial Distress (%)
For the Electronic Components subindustry, Micropac Industries's Probability of Financial Distress (%), along with its competitors' market caps and Probability of Financial Distress (%) data, can be viewed below:
* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.
Micropac Industries's Probability of Financial Distress (%) Distribution in the Hardware Industry
For the Hardware industry and Technology sector, Micropac Industries's Probability of Financial Distress (%) distribution charts can be found below:
* The bar in red indicates where Micropac Industries's Probability of Financial Distress (%) falls into.
Micropac Industries Probability of Financial Distress (%) Calculation
Probability of Financial Distress (%) (PFD) was developed by John Campbell, Jens Hilscher and Jan Szilagyi in their Search of Distress Risk. It measures the probability that a company will go bankrupt within the next 12 months given its current financial position.
The Probability of Financial Distress (%) was obtained by a logit probability model based on eight explanatory variables. The logit formula to compute the probability of financial distress (LPFD) is given below:
| LPFD | = | -20.12 * NIMTAAVG | + | 1.60 * TLMTA | - | 7.88 * EXRETAVG | + | 1.55 * SIGMA | - | 0.005 * RSIZE | - | 2.27 * CASHMTA | + | 0.070 * MB | - | 0.09 * PRICE | - | 8.87 |
| = | -8.15 |
The Probability of Financial Distress (%) (PFD) was then obtianed by:
| PFD | = | 1 | / | (1 + e^(-LPFD)) | * | 100% |
| = | 0.03% |
The eight explanatory variables are:
1. NIMTAAVG = Net Income to Market Total Assets
*Note that for companies reported quarterly, geometrically declining weighted quarterly Net Income data in latest four quarters are used.
2. TLMTA = Total liabilities to Market Total Assets
3. CASHMTA = Cash to Market Total Assets
For non-financial companies, CASHMTA is measured as:
4. EXRETAVG = Excess Return compared to the S&P 500
EXRETAVG is the weighted excess return compared to the S&P 500 in past 12 month. Geometrically declining weights are imposed on the monthly excess return to reflect lagged information. The weight is halved each quarter.
5. SIGMA = Standard Deviation of Daily Returns
For sigma, we use the annualized standard deviation of a company's returns over the past 92 days (or 63 trading days).
6. RSIZE = Relative Size
| RSIZE | = | log (Market Cap | / | Total Market Cap of S&P 500 companies) |
7. MB = Market to Adjusted Book Equity Ratio
8. PRICE
PRICE is measured as the log of the stock price, capped at log(15).
Micropac Industries (Micropac Industries) Business Description
Traded in Other Exchanges
N/A
Address
905 East Walnut Street, Garland, TX, USA, 75040
Micropac Industries Inc manufactures and distributes a range of hybrid microelectronic circuits, solid-state relays (SSRs), power controllers, and optoelectronic components and assemblies. Its products are used as components in a range of military, space, and industrial systems, including aircraft instrumentation and navigation systems, power supplies, electronic controls, computers, medical devices, and high-temperature products. The company's core technology is the packaging and interconnecting of multi-chip microelectronics modules. Other technologies include light-emitting, and light-sensitive materials and products, including light-emitting diodes (LEDs) and silicon phototransistors used in the company's optoelectronic components and assemblies.
Executives
| Mark W King |
director, officer: Chief Executive Officer |
2905 WYNDHAM LANE, RICHARDSON TX 75082 |
| Richard K Hoesterey |
director |
7852 LA COSA DRIVE, DALLAS TX 75248 |
| Eugene A. Robinson |
director |
1200 LAKE POINT CIRCLE, MCKINNEY TX 75070 |
| Heinz-werner Hempel |
director, 10 percent owner |
AM WALL 127 D-281951, BREMEN 2M 00000 |
| Micropac Industries, Inc. |
10 percent owner |
AM WALL 127 D-281951 1, BREMEN 2M 00000 |
| Patrick Cefalu |
officer: CFO |
8706 ARBORSIDE, ROWLETT TX 75089 |
| Wood Connie J. |
director |
877 FM 2948, COMO TX 75431 |
| H. Kent Hearn |
director |
1409 BRIAR HOLLOW, GARLAND TX 75043 |
Micropac Industries (Micropac Industries) Headlines
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