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Japan Pure Chemical Co (TSE:4973) Float Percentage Of Total Shares Outstanding : 0.00% (As of Jun. 09, 2024)


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What is Japan Pure Chemical Co Float Percentage Of Total Shares Outstanding?

Float percentage of total shares outstanding is the percentage of float shares relative to the total shares outstanding. As of today, Japan Pure Chemical Co's float shares is 0.00 Mil. Japan Pure Chemical Co's total shares outstanding is 5.76 Mil. Japan Pure Chemical Co's float percentage of total shares outstanding is 0.00%.

Insider Ownership is the percentage of shares that are owned by company insiders relative to the total shares outstanding. As of today, Japan Pure Chemical Co's Insider Ownership is 0.00%.

Institutional Ownership is the percentage of shares that are owned by institutions out of the total shares outstanding. As of today, Japan Pure Chemical Co's Institutional Ownership is 12.23%.


Japan Pure Chemical Co Float Percentage Of Total Shares Outstanding Calculation

It is the percentage of float shares out of the total shares outstanding.

Japan Pure Chemical Co's Float Percentage of Total Shares Outstanding for today is calculated as follows:

Float Percentage of Total Shares Outstanding=Float Shares/Total Shares Outstanding
=0.00/5.76
=0.00%

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Japan Pure Chemical Co (TSE:4973) Business Description

Industry
GURUFOCUS.COM » STOCK LIST » Basic Materials » Chemicals » Japan Pure Chemical Co Ltd (TSE:4973) » Definitions » Float Percentage Of Total Shares Outstanding
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Address
3-10-18 Kitamachi, Nerima-ku, Tokyo, JPN, 179-0081
Japan Pure Chemical Co Ltd develops, manufactures, and sells precious metal plating chemicals for electronic devices in Japan. It offers gold electroplating formulation for semiconductor applications such as connector and soldering uses; and palladium electroplating formulation for the connector, lead frame, and decorative uses. The firm also provides a gold coating for soldering and wire bonding; electroless palladium plating formulation for wire bonding and soldering uses; and silver plating formulations. In addition, it offers strike gold plating formulation that enhances the adherence of plated coatings.

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