Niche-Tech Semiconductor Materials (HKSE:08490) Asset Impairment Charge : HK$0.0 Mil (TTM As of Jun. 2024)

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What is Niche-Tech Semiconductor Materials Asset Impairment Charge?

Niche-Tech Semiconductor Materials's Asset Impairment Charge for the three months ended in Jun. 2024 was HK$0.0 Mil. Its Asset Impairment Charge for the trailing twelve months (TTM) ended in Jun. 2024 was HK$0.0 Mil.

Niche-Tech Semiconductor Materials Asset Impairment Charge Historical Data

The historical data trend for Niche-Tech Semiconductor Materials's Asset Impairment Charge can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Niche-Tech Semiconductor Materials Asset Impairment Charge Chart

Niche-Tech Semiconductor Materials Annual Data

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Asset Impairment Charge

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Niche-Tech Semiconductor Materials Quarterly Data
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Niche-Tech Semiconductor Materials Asset Impairment Charge Calculation

Asset Impairment Charge is the charge against earnings resulting from the aggregate write down of all assets from their carrying value to their fair value.

Asset Impairment Charge for the trailing twelve months (TTM) ended in Jun. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was HK$0.0 Mil.

Niche-Tech Semiconductor Materials Asset Impairment Charge Related Terms

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Niche-Tech Semiconductor Materials Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Niche-Tech Semiconductor Materials Ltd (HKSE:08490) » Definitions » Asset Impairment Charge

Comparable Companies

Traded in Other Exchanges

N/A

Address

Unit 208, 2nd Floor, Lakeside 1, Phase Two, Hong Kong Science Park, Pak Shek Kok, New Territories, Hong Kong, HKG

Website

https://www.nichetech.com.hk

Niche-Tech Semiconductor Materials Ltd is a semiconductor packaging materials manufacturer. Its products are divided into Bonding Wires, Encapsulants, and Others. Bonding wires include developing, manufacturing, and supply of fine and ultra-fine Bonding Wires such as gold, gold alloy, silver alloy, aluminum, silicone aluminum, copper, copper alloy, and palladium-coated copper. Other products mainly include solder wire, solder bar, solder paste, and bonding tools for PCB application, and Encapsulant includes high-purity liquid glob-top epoxy for COB applications and others. The company generates a majority of its revenue from Bonding wires, and geographically from the People's Republic of China.

Executives

Chows Investment Group Limited	2201 Interest of corporation controlled by you
Niche-tech Investment Holdings Limited	2101 Beneficial owner
Cheng Pak Ching	2202 Interest of your spouse
Ma Ah Muk	2101 Beneficial owner
Chow Chun Kay Stephen	2201 Interest of corporation controlled by you
Chow Fung Wai Lan Rita	2202 Interest of your spouse
Chow Bok Hin Felix	2201 Interest of corporation controlled by you
Chow Kuo Li Jen	2202 Interest of your spouse

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