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Shennan Circuits Co (SZSE:002916) Debt-to-Asset : 0.14 (As of Mar. 2024)


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What is Shennan Circuits Co Debt-to-Asset?

Shennan Circuits Co's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was ¥770 Mil. Shennan Circuits Co's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was ¥2,519 Mil. Shennan Circuits Co's Long-Term Debt & Capital Lease ObligationTotal Assets for the quarter that ended in Mar. 2024 was ¥23,339 Mil. Shennan Circuits Co's debt to asset for the quarter that ended in Mar. 2024 was 0.14.


Shennan Circuits Co Debt-to-Asset Historical Data

The historical data trend for Shennan Circuits Co's Debt-to-Asset can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Shennan Circuits Co Debt-to-Asset Chart

Shennan Circuits Co Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Debt-to-Asset
Get a 7-Day Free Trial Premium Member Only Premium Member Only 0.24 0.13 0.14 0.13 0.14

Shennan Circuits Co Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
Debt-to-Asset Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 0.11 0.14 0.14 0.14 0.14

Competitive Comparison of Shennan Circuits Co's Debt-to-Asset

For the Electronic Components subindustry, Shennan Circuits Co's Debt-to-Asset, along with its competitors' market caps and Debt-to-Asset data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Shennan Circuits Co's Debt-to-Asset Distribution in the Hardware Industry

For the Hardware industry and Technology sector, Shennan Circuits Co's Debt-to-Asset distribution charts can be found below:

* The bar in red indicates where Shennan Circuits Co's Debt-to-Asset falls into.



Shennan Circuits Co Debt-to-Asset Calculation

Debt to Asset measures the financial leverage a company has.

Shennan Circuits Co's Debt-to-Asset for the fiscal year that ended in Dec. 2023 is calculated as

Debt-to-Asset=Total Debt / Total Assets
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Total Assets
=(757.411 + 2426.219) / 22606.868
=0.14

Shennan Circuits Co's Debt-to-Asset for the quarter that ended in Mar. 2024 is calculated as

Debt-to-Asset=Total Debt / Total Assets
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Total Assets
=(770.498 + 2519.475) / 23339.15
=0.14

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Shennan Circuits Co  (SZSE:002916) Debt-to-Asset Explanation

In the calculation of Debt-to-Asset, we use the total of Short-Term Debt & Capital Lease Obligation and Long-Term Debt & Capital Lease Obligation divided by Total Assets.


Shennan Circuits Co Debt-to-Asset Related Terms

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Shennan Circuits Co (SZSE:002916) Business Description

Traded in Other Exchanges
N/A
Address
No. 99, Qiao Cheng EAST Road, Nanshan District, Shenzhen, CHN
Shennan Circuits Co Ltd is a China-based printed circuit board and the packaging substrate manufacturer. The company operates in five business divisions including design services, printed circuit board, printed circuit board assembly, the package substrate, and laminated busbar. It provides products and services for the communication equipment manufacturers, aeronautics, and astronautics electronic manufacturers.
Executives
Wang Cheng Yong Executives
Zhang Li Jun Directors, executives
Yang Zhi Cheng Director
Zhang Li Hua Executives
Gong Jian Executives
Zhou Jin Qun Directors, executives
Xie Yan Hong Supervisors

Shennan Circuits Co (SZSE:002916) Headlines

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