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Waffer Technology (TPE:6235) Debt-to-Asset : 0.19 (As of Mar. 2024)


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What is Waffer Technology Debt-to-Asset?

Waffer Technology's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was NT$1,000 Mil. Waffer Technology's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was NT$710 Mil. Waffer Technology's Long-Term Debt & Capital Lease ObligationTotal Assets for the quarter that ended in Mar. 2024 was NT$9,184 Mil. Waffer Technology's debt to asset for the quarter that ended in Mar. 2024 was 0.19.


Waffer Technology Debt-to-Asset Historical Data

The historical data trend for Waffer Technology's Debt-to-Asset can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Waffer Technology Debt-to-Asset Chart

Waffer Technology Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Debt-to-Asset
Get a 7-Day Free Trial Premium Member Only Premium Member Only 0.28 0.21 0.21 0.12 0.19

Waffer Technology Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
Debt-to-Asset Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 0.13 0.17 0.20 0.19 0.19

Competitive Comparison of Waffer Technology's Debt-to-Asset

For the Metal Fabrication subindustry, Waffer Technology's Debt-to-Asset, along with its competitors' market caps and Debt-to-Asset data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Waffer Technology's Debt-to-Asset Distribution in the Industrial Products Industry

For the Industrial Products industry and Industrials sector, Waffer Technology's Debt-to-Asset distribution charts can be found below:

* The bar in red indicates where Waffer Technology's Debt-to-Asset falls into.



Waffer Technology Debt-to-Asset Calculation

Debt to Asset measures the financial leverage a company has.

Waffer Technology's Debt-to-Asset for the fiscal year that ended in Dec. 2023 is calculated as

Debt-to-Asset=Total Debt / Total Assets
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Total Assets
=(827.887 + 702.595) / 8285.571
=0.18

Waffer Technology's Debt-to-Asset for the quarter that ended in Mar. 2024 is calculated as

Debt-to-Asset=Total Debt / Total Assets
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Total Assets
=(1000.254 + 710.102) / 9183.557
=0.19

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Waffer Technology  (TPE:6235) Debt-to-Asset Explanation

In the calculation of Debt-to-Asset, we use the total of Short-Term Debt & Capital Lease Obligation and Long-Term Debt & Capital Lease Obligation divided by Total Assets.


Waffer Technology Debt-to-Asset Related Terms

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Waffer Technology (TPE:6235) Business Description

Traded in Other Exchanges
N/A
Address
No.200 Wenhua 2nd Rd, Guishan Township, Taoyuan, TWN, 33377
Waffer Technology Corp is a Taiwan-based company, that engages in the manufacture and sale of magnesium alloy and aluminum alloy die-casting components and products. It is engaged in the provision of a light-metal solution of magnesium and aluminum alloy, mold and tooling research and development, magnesium alloy injection, magnesium die-casting, CNC, and painting and assembly of vertical integration OEM/ODM processing. It serves its services to medical, industrial, telecommunications, construction, automotive, sporting goods, aeronautical, transportation, national defense, and other industries.

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