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RFsemi Technologies (XKRX:096610) Debt-to-Asset : 0.25 (As of Mar. 2024)


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What is RFsemi Technologies Debt-to-Asset?

RFsemi Technologies's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was ₩6,420 Mil. RFsemi Technologies's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was ₩1,467 Mil. RFsemi Technologies's Long-Term Debt & Capital Lease ObligationTotal Assets for the quarter that ended in Mar. 2024 was ₩31,945 Mil. RFsemi Technologies's debt to asset for the quarter that ended in Mar. 2024 was 0.25.


RFsemi Technologies Debt-to-Asset Historical Data

The historical data trend for RFsemi Technologies's Debt-to-Asset can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

RFsemi Technologies Debt-to-Asset Chart

RFsemi Technologies Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Debt-to-Asset
Get a 7-Day Free Trial Premium Member Only Premium Member Only 0.40 0.46 0.44 0.45 0.29

RFsemi Technologies Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
Debt-to-Asset Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 0.33 0.22 0.20 0.29 0.25

Competitive Comparison of RFsemi Technologies's Debt-to-Asset

For the Semiconductor Equipment & Materials subindustry, RFsemi Technologies's Debt-to-Asset, along with its competitors' market caps and Debt-to-Asset data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


RFsemi Technologies's Debt-to-Asset Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, RFsemi Technologies's Debt-to-Asset distribution charts can be found below:

* The bar in red indicates where RFsemi Technologies's Debt-to-Asset falls into.



RFsemi Technologies Debt-to-Asset Calculation

Debt to Asset measures the financial leverage a company has.

RFsemi Technologies's Debt-to-Asset for the fiscal year that ended in Dec. 2023 is calculated as

Debt-to-Asset=Total Debt / Total Assets
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Total Assets
=(7245.404 + 1494.152) / 30619.481
=0.29

RFsemi Technologies's Debt-to-Asset for the quarter that ended in Mar. 2024 is calculated as

Debt-to-Asset=Total Debt / Total Assets
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Total Assets
=(6419.879 + 1466.522) / 31945.176
=0.25

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


RFsemi Technologies  (XKRX:096610) Debt-to-Asset Explanation

In the calculation of Debt-to-Asset, we use the total of Short-Term Debt & Capital Lease Obligation and Long-Term Debt & Capital Lease Obligation divided by Total Assets.


RFsemi Technologies Debt-to-Asset Related Terms

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RFsemi Technologies (XKRX:096610) Business Description

Traded in Other Exchanges
N/A
Address
52, Dunsan-ro, 302-869, Micacle Building, 11th Floor, Seo-gu, Daejeon, KOR
RFsemi Technologies Inc is engaged in developing, manufacturing and selling semiconductor devices in South Korea and internationally. Its products include ECM transistors/IC chips, MEMS microphones, ECM modules, transient voltage suppressor diodes, Zener diodes, and Schottky barrier diodes. The company also offers LED lights, such as the bulb, down, panel, spot, candle, tube, linear, high bay, ceiling, room, and street lights; and LED modules for high bay, panel and bulb type, street, downlight, and floodlights.

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