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HPSP Co (XKRX:403870) Total Debt per Share : ₩0.00 (As of Mar. 2024)


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What is HPSP Co Total Debt per Share?

₩0.00 (As of Mar. 2024)

Total Debt per Share is calculated as total debt divided by Shares Outstanding (EOP). Total debt is calculated as Long-Term Debt & Capital Lease Obligation plus Short-Term Debt & Capital Lease Obligation. HPSP Co's Total Debt Per Share for the quarter that ended in Mar. 2024 was ₩0.00.


HPSP Co Total Debt per Share Historical Data

The historical data trend for HPSP Co's Total Debt per Share can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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HPSP Co Total Debt per Share Chart

HPSP Co Annual Data
Trend Dec20 Dec21 Dec22 Dec23
Total Debt per Share
18.88 34.80 37.56 27.02

HPSP Co Quarterly Data
Mar21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
Total Debt per Share Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only 35.71 33.20 31.06 27.02 -

HPSP Co Total Debt per Share Calculation

HPSP Co's Total Debt Per Share for the fiscal year that ended in Dec. 2023 is calculated as:

HPSP Co's Total Debt Per Share for the quarter that ended in Mar. 2024 is calculated as:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


HPSP Co Total Debt per Share Related Terms

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HPSP Co (XKRX:403870) Business Description

Traded in Other Exchanges
N/A
Address
65, Omokcheon-ro 152beon-gil, Gwonseon-gu, Gyeonggi-do, Suwon-si, KOR, 16642
HPSP Co Ltd is engaged in the manufacturing of semiconductor machines and types of equipment. It manufactures High-pressure hydrogen annealing equipment.

HPSP Co (XKRX:403870) Headlines

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