HKSE:08490 (Hong Kong)
Â
Ordinary Shares
HK$
0.15
(-0.68%)
Jun 4
Current and historical daily PE Ratio for Niche-Tech Semiconductor Materials Ltd (
HKSE:08490
) from 2018 to Jun 05 2024. The price to earnings ratio is calculated by taking the current stock price and dividing it by the most recent trailing twelve-month earnings per share (EPS) number. The data is updated every 20 minutes during market hours. The PE ratio can be viewed as the number of years it takes for the company to earn back the price you pay for the stock. Therefore, lower-P/E stocks are more attractive than higher P/E stocks so long as the PE ratio is positive. Also for stocks with the same PE ratio, the one with faster growth business is more attractive. Niche-Tech Semiconductor Materials stock (HKSE:08490) PE ratio as of Jun 05 2024 is 9999.
More Details
Niche-Tech Semiconductor Materials Ltd (HKSE:08490) PE Ratio (TTM) Chart
Niche-Tech Semiconductor Materials Ltd (HKSE:08490) PE Ratio (TTM) Historical Data
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| Niche-Tech Semiconductor Materials PE Ratio (TTM) Historical Data | |||
|---|---|---|---|
| Date | PE Ratio (TTM) Data | Date | PE Ratio (TTM) Data |
| 2024-06-05 | At Loss | 2024-03-27 | At Loss |
| 2024-06-04 | At Loss | 2024-03-26 | At Loss |
| 2024-06-03 | At Loss | 2024-03-25 | At Loss |
| 2024-05-31 | At Loss | 2024-03-22 | At Loss |
| 2024-05-30 | At Loss | 2024-03-21 | At Loss |
| 2024-05-29 | At Loss | 2024-03-20 | At Loss |
| 2024-05-28 | At Loss | 2024-03-19 | At Loss |
| 2024-05-27 | At Loss | 2024-03-18 | At Loss |
| 2024-05-24 | At Loss | 2024-03-15 | At Loss |
| 2024-05-23 | At Loss | 2024-03-14 | At Loss |
| 2024-05-22 | At Loss | 2024-03-13 | At Loss |
| 2024-05-21 | At Loss | 2024-03-12 | At Loss |
| 2024-05-20 | At Loss | 2024-03-11 | At Loss |
| 2024-05-17 | At Loss | 2024-03-08 | At Loss |
| 2024-05-16 | At Loss | 2024-03-07 | At Loss |
| 2024-05-14 | At Loss | 2024-03-06 | At Loss |
| 2024-05-13 | At Loss | 2024-03-05 | At Loss |
| 2024-05-10 | At Loss | 2024-03-04 | At Loss |
| 2024-05-09 | At Loss | 2024-03-01 | At Loss |
| 2024-05-08 | At Loss | 2024-02-29 | At Loss |
| 2024-05-07 | At Loss | 2024-02-28 | At Loss |
| 2024-05-06 | At Loss | 2024-02-27 | At Loss |
| 2024-05-03 | At Loss | 2024-02-26 | At Loss |
| 2024-05-02 | At Loss | 2024-02-23 | At Loss |
| 2024-04-30 | At Loss | 2024-02-22 | At Loss |
| 2024-04-29 | At Loss | 2024-02-21 | At Loss |
| 2024-04-26 | At Loss | 2024-02-20 | At Loss |
| 2024-04-25 | At Loss | 2024-02-19 | At Loss |
| 2024-04-24 | At Loss | 2024-02-16 | At Loss |
| 2024-04-23 | At Loss | 2024-02-15 | At Loss |
| 2024-04-22 | At Loss | 2024-02-14 | At Loss |
| 2024-04-19 | At Loss | 2024-02-09 | At Loss |
| 2024-04-18 | At Loss | 2024-02-08 | At Loss |
| 2024-04-17 | At Loss | 2024-02-07 | At Loss |
| 2024-04-16 | At Loss | 2024-02-06 | At Loss |
| 2024-04-15 | At Loss | 2024-02-05 | At Loss |
| 2024-04-12 | At Loss | 2024-02-02 | At Loss |
| 2024-04-11 | At Loss | 2024-02-01 | At Loss |
| 2024-04-10 | At Loss | 2024-01-31 | At Loss |
| 2024-04-09 | At Loss | 2024-01-30 | At Loss |
| 2024-04-08 | At Loss | 2024-01-29 | At Loss |
| 2024-04-05 | At Loss | 2024-01-26 | At Loss |
| 2024-04-03 | At Loss | 2024-01-25 | At Loss |
| 2024-04-02 | At Loss | 2024-01-24 | At Loss |
| 2024-03-28 | At Loss | 2024-01-23 | At Loss |
Niche-Tech Semiconductor Materials Ltd (HKSE:08490) PE Ratio (TTM) Comparison
| Company | Market Cap(Mil) | PE Ratio (TTM) |
|---|
Business Description
Business Description
Niche-Tech Semiconductor Materials Ltd
NAICS : 334413
SIC : 3577
ISIN : KYG6541R1065
Share Class Description:
HKSE:08490: Ordinary SharesCompare
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Traded in other countries / regions
08490.Hong Kong IPO Date
2018-05-30Description
Niche-Tech Semiconductor Materials Ltd is a semiconductor packaging materials manufacturer. Its products are divided into Bonding Wires, Encapsulants, and Others. Bonding wires include developing, manufacturing, and supply of fine and ultra-fine Bonding Wires such as gold, gold alloy, silver alloy, aluminum, silicone aluminum, copper, copper alloy, and palladium-coated copper. Other products mainly include solder wire, solder bar, solder paste, and bonding tools for PCB application, and Encapsulant includes high-purity liquid glob-top epoxy for COB applications and others. The company generates a majority of its revenue from Bonding wires, and geographically from the People's Republic of China.
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