Business Description

Description
Unisem (M) Bhd provides semiconductor assembly and test services in Malaysia. Unisem's assembly and test services include wafer bumping, wafer probing, wafer grinding, a range of leadframe and substrate integrated circuits packaging, wafer-level CSP (chip scale packaging), flip chip and radio frequency, analog, digital and mixed-signal testing services. Its turnkey services include design, assembly, test, failure analysis, electrical and thermal characterization, warehousing and drop-ship services. The company has a business presence in Asia, Europe and the United States of America.

Financials

XKLS:5005's 30-Y Financials
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Historical Operating Revenue by Business Segment

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Performance

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Unisem (M) Bhd Executives

Details

Valuation Chart

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Analyst Estimate

Key Statistics

Name Value
Revenue (TTM) (Mil RM) 1,439.686
EPS (TTM) (RM) 0.05
Beta 0.8
Volatility % 26.14
14-Day RSI 53.72
14-Day ATR (RM) 0.101539
20-Day SMA (RM) 3.6765
12-1 Month Momentum % 23.08
52-Week Range (RM) 2.75 - 3.92
Shares Outstanding (Mil) 1,613.08

Piotroski F-Score Details

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Component Result
Piotroski F-Score 5
Positive ROA
Positive CFROA
Higher ROA yoy
CFROA > ROA
Lower Leverage yoy
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Unisem (M) Bhd Filings

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Unisem (M) Bhd Stock Events

Financials Calendars
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Unisem (M) Bhd Frequently Asked Questions

What is Unisem (M) Bhd(XKLS:5005)'s stock price today?
The current price of XKLS:5005 is RM3.64. The 52 week high of XKLS:5005 is RM3.92 and 52 week low is RM2.75.
When is next earnings date of Unisem (M) Bhd(XKLS:5005)?
The next earnings date of Unisem (M) Bhd(XKLS:5005) is .
Does Unisem (M) Bhd(XKLS:5005) pay dividends? If so, how much?
The  Dividend Yield %  of Unisem (M) Bhd(XKLS:5005) is 2.2% (As of Today), Highest Dividend Payout Ratio of Unisem (M) Bhd(XKLS:5005) was 1.57. The lowest was 0.31. And the median was 0.42. The  Forward Dividend Yield % of Unisem (M) Bhd(XKLS:5005) is 2.2%. For more information regarding to dividend, please check our Dividend Page.

Press Release

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