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HANMI Semiconductor Co (XKRX:042700) Float Percentage Of Total Shares Outstanding : 0.00% (As of May. 31, 2024)


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What is HANMI Semiconductor Co Float Percentage Of Total Shares Outstanding?

Float percentage of total shares outstanding is the percentage of float shares relative to the total shares outstanding. As of today, HANMI Semiconductor Co's float shares is 0.00 Mil. HANMI Semiconductor Co's total shares outstanding is 96.48 Mil. HANMI Semiconductor Co's float percentage of total shares outstanding is 0.00%.

Insider Ownership is the percentage of shares that are owned by company insiders relative to the total shares outstanding. As of today, HANMI Semiconductor Co's Insider Ownership is 0.00%.

Institutional Ownership is the percentage of shares that are owned by institutions out of the total shares outstanding. As of today, HANMI Semiconductor Co's Institutional Ownership is 13.06%.


HANMI Semiconductor Co Float Percentage Of Total Shares Outstanding Calculation

It is the percentage of float shares out of the total shares outstanding.

HANMI Semiconductor Co's Float Percentage of Total Shares Outstanding for today is calculated as follows:

Float Percentage of Total Shares Outstanding=Float Shares/Total Shares Outstanding
=0.00/96.48
=0.00%

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


HANMI Semiconductor Co (XKRX:042700) Business Description

Industry
Traded in Other Exchanges
N/A
Address
532-2 Gajwa-Dong, Seo-gu, Incheon, KOR, 404-250
HANMI Semiconductor Co Ltd operates in semiconductor equipment business. The company has the largest worldwide market share for sewing and placement system. Its product portfolio divides into three main segments: Semiconductor Equipment, Laser Application Processes, PV and LED. Semiconductor division offer equipment such as singulation, flip chip binder, molding, trim and form, marking, inspection, pick and place, attach and detach, and PCB equipment. Laser Application Processes comprises laser marking, laser ablation, laser cutting and singulation as well as reel to reel laser. PV and LED offer equipment including PV brick IR inspection, PV wafer inspection, LED manual mold, among others.

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