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HANMI Semiconductor Co (XKRX:042700) Other Current Liabilities : ₩17,577 Mil (As of Mar. 2024)


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What is HANMI Semiconductor Co Other Current Liabilities?

HANMI Semiconductor Co's other current liabilities for the quarter that ended in Mar. 2024 was ₩17,577 Mil.

HANMI Semiconductor Co's quarterly other current liabilities increased from Sep. 2023 (₩16,246 Mil) to Dec. 2023 (₩18,972 Mil) but then declined from Dec. 2023 (₩18,972 Mil) to Mar. 2024 (₩17,577 Mil).

HANMI Semiconductor Co's annual other current liabilities increased from Dec. 2021 (₩22,357 Mil) to Dec. 2022 (₩24,209 Mil) but then declined from Dec. 2022 (₩24,209 Mil) to Dec. 2023 (₩18,972 Mil).


HANMI Semiconductor Co Other Current Liabilities Historical Data

The historical data trend for HANMI Semiconductor Co's Other Current Liabilities can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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HANMI Semiconductor Co Other Current Liabilities Chart

HANMI Semiconductor Co Annual Data
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Other Current Liabilities
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HANMI Semiconductor Co Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
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HANMI Semiconductor Co Other Current Liabilities Calculation

The liability a company needs to pay in the next 12 months, but not assigned to Accounts Payable or Debt. For instance, Wal-Mart (WMT) has accrued wages, salaries, valuation, bonuses, insurance liabilities, accrued tax etc. These are all included in other current liabilities.


HANMI Semiconductor Co Other Current Liabilities Related Terms

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HANMI Semiconductor Co (XKRX:042700) Business Description

Traded in Other Exchanges
N/A
Address
532-2 Gajwa-Dong, Seo-gu, Incheon, KOR, 404-250
HANMI Semiconductor Co Ltd operates in semiconductor equipment business. The company has the largest worldwide market share for sewing and placement system. Its product portfolio divides into three main segments: Semiconductor Equipment, Laser Application Processes, PV and LED. Semiconductor division offer equipment such as singulation, flip chip binder, molding, trim and form, marking, inspection, pick and place, attach and detach, and PCB equipment. Laser Application Processes comprises laser marking, laser ablation, laser cutting and singulation as well as reel to reel laser. PV and LED offer equipment including PV brick IR inspection, PV wafer inspection, LED manual mold, among others.

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