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HANMI Semiconductor Co (XKRX:042700) Asset Impairment Charge : ₩0 Mil (TTM As of Jun. 2024)


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What is HANMI Semiconductor Co Asset Impairment Charge?

HANMI Semiconductor Co's Asset Impairment Charge for the three months ended in Jun. 2024 was ₩0 Mil. Its Asset Impairment Charge for the trailing twelve months (TTM) ended in Jun. 2024 was ₩0 Mil.

HANMI Semiconductor Co Asset Impairment Charge Historical Data

The historical data trend for HANMI Semiconductor Co's Asset Impairment Charge can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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HANMI Semiconductor Co Asset Impairment Charge Chart

HANMI Semiconductor Co Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Asset Impairment Charge
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HANMI Semiconductor Co Quarterly Data
Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24 Jun24
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HANMI Semiconductor Co Asset Impairment Charge Calculation

Asset Impairment Charge is the charge against earnings resulting from the aggregate write down of all assets from their carrying value to their fair value.

Asset Impairment Charge for the trailing twelve months (TTM) ended in Jun. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was ₩0 Mil.

HANMI Semiconductor Co Asset Impairment Charge Related Terms

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HANMI Semiconductor Co Business Description

Industry
GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » HANMI Semiconductor Co Ltd (XKRX:042700) » Definitions » Asset Impairment Charge
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Traded in Other Exchanges
N/A
Address
532-2 Gajwa-Dong, Seo-gu, Incheon, KOR, 404-250
Website
http://www.hanmisemi.com
HANMI Semiconductor Co Ltd operates in semiconductor equipment business. The company has the largest worldwide market share for sewing and placement system. Its product portfolio divides into three main segments: Semiconductor Equipment, Laser Application Processes, PV and LED. Semiconductor division offer equipment such as singulation, flip chip binder, molding, trim and form, marking, inspection, pick and place, attach and detach, and PCB equipment. Laser Application Processes comprises laser marking, laser ablation, laser cutting and singulation as well as reel to reel laser. PV and LED offer equipment including PV brick IR inspection, PV wafer inspection, LED manual mold, among others.

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