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HANMI Semiconductor Co (XKRX:042700) Margin of Safety % (DCF Earnings Based) : -375.01% (As of Jun. 05, 2024)


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What is HANMI Semiconductor Co Margin of Safety % (DCF Earnings Based)?

Margin of Safety % (DCF Earnings Based) = (Intrinsic Value: DCF (Earnings Based) - Current Price) / Intrinsic Value: DCF (Earnings Based).

Note: Discounted Earnings model is only suitable for predictable companies (Business Predictability Rank higher than 1-Star). If the company's Predictability Rank is 1-Star or Not Rated, result may not be accurate due to the low predictability of business and the data will not be stored into our database.

As of today (2024-06-05), HANMI Semiconductor Co's Predictability Rank is 2.5-Stars. HANMI Semiconductor Co's intrinsic value calculated from the Discounted Earnings model is ₩31283.43 and current share price is ₩148600.00. Consequently,

HANMI Semiconductor Co's Margin of Safety % (DCF Earnings Based) using Discounted Earnings model is -375.01%.

Competitive Comparison of HANMI Semiconductor Co's Margin of Safety % (DCF Earnings Based)

For the Semiconductor Equipment & Materials subindustry, HANMI Semiconductor Co's Margin of Safety % (DCF Earnings Based), along with its competitors' market caps and Margin of Safety % (DCF Earnings Based) data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.

HANMI Semiconductor Co's Margin of Safety % (DCF Earnings Based) Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, HANMI Semiconductor Co's Margin of Safety % (DCF Earnings Based) distribution charts can be found below:

* The bar in red indicates where HANMI Semiconductor Co's Margin of Safety % (DCF Earnings Based) falls into.


HANMI Semiconductor Co Margin of Safety % (DCF Earnings Based) Calculation

HANMI Semiconductor Co's Margin of Safety % (DCF Earnings Based) for today is calculated as

Margin of Safety % (DCF Earnings Based)=(Intrinsic Value: DCF (Earnings Based)-Current Price)/Intrinsic Value: DCF (Earnings Based)
=(31283.43-148600.00)/31283.43
=-375.01 %

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

The intrinsic value is calculated from the Discounted Earnings model with default parameters. The calculation method is the same as Discounted Cash Flow model except earnings are used in the calculation instead of free cash flow.

HANMI Semiconductor Co Margin of Safety % (DCF Earnings Based) Related Terms

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HANMI Semiconductor Co (XKRX:042700) Business Description

Industry
GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » HANMI Semiconductor Co Ltd (XKRX:042700) » Definitions » Margin of Safety % (DCF Earnings Based)
Comparable Companies
XKRX:039030 XKRX:095340 XKRX:240810 XKRX:064760 XKRX:166090 XKRX:084370 XKRX:101490 XKRX:195870 XKRX:420770 XKRX:098460 XAMS:ASML AMAT LRCX KLAC TSE:8035 SHSE:601012 XAMS:ASM TSE:6146 TSE:6857 SZSE:002371
Traded in Other Exchanges
N/A
Address
532-2 Gajwa-Dong, Seo-gu, Incheon, KOR, 404-250
Website
http://www.hanmisemi.com
HANMI Semiconductor Co Ltd operates in semiconductor equipment business. The company has the largest worldwide market share for sewing and placement system. Its product portfolio divides into three main segments: Semiconductor Equipment, Laser Application Processes, PV and LED. Semiconductor division offer equipment such as singulation, flip chip binder, molding, trim and form, marking, inspection, pick and place, attach and detach, and PCB equipment. Laser Application Processes comprises laser marking, laser ablation, laser cutting and singulation as well as reel to reel laser. PV and LED offer equipment including PV brick IR inspection, PV wafer inspection, LED manual mold, among others.

HANMI Semiconductor Co (XKRX:042700) Headlines

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