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HANMI Semiconductor Co (XKRX:042700) Dividends per Share : ₩420.00 (TTM As of Mar. 2024)


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What is HANMI Semiconductor Co Dividends per Share?

HANMI Semiconductor Co's dividends per share for the three months ended in Mar. 2024 was ₩420.00. Its dividends per share for the trailing twelve months (TTM) ended in Mar. 2024 was ₩420.00. Its Dividend Payout Ratio for the three months ended in Mar. 2024 was 0.58. As of today, HANMI Semiconductor Co's Dividend Yield % is 0.28%.

Warning Sign:

HANMI Semiconductor Co Ltd stock dividend yield is close to 10-year low.

During the past 12 months, HANMI Semiconductor Co's average Dividends Per Share Growth Rate was 110.00% per year. Please click Growth Rate Calculation Example (GuruFocus) to see how GuruFocus calculates Wal-Mart Stores Inc (WMT)'s revenue growth rate. You can apply the same method to get the average dividends per share growth rate.

During the past 13 years, the highest 3-Year average Dividends Per Share Growth Rate of HANMI Semiconductor Co was 71.00% per year. The lowest was -20.60% per year. And the median was 33.90% per year.

For more information regarding to dividend, please check our Dividend Page.


HANMI Semiconductor Co Dividends per Share Historical Data

The historical data trend for HANMI Semiconductor Co's Dividends per Share can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

HANMI Semiconductor Co Dividends per Share Chart

HANMI Semiconductor Co Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Dividends per Share
Get a 7-Day Free Trial Premium Member Only Premium Member Only 50.00 200.00 300.00 200.00 -

HANMI Semiconductor Co Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
Dividends per Share Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only - - - - 420.00

Competitive Comparison of HANMI Semiconductor Co's Dividends per Share

For the Semiconductor Equipment & Materials subindustry, HANMI Semiconductor Co's Dividend Yield %, along with its competitors' market caps and Dividend Yield % data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


HANMI Semiconductor Co's Dividend Yield % Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, HANMI Semiconductor Co's Dividend Yield % distribution charts can be found below:

* The bar in red indicates where HANMI Semiconductor Co's Dividend Yield % falls into.



HANMI Semiconductor Co Dividends per Share Calculation

Dividends paid to per common share.


HANMI Semiconductor Co  (XKRX:042700) Dividends per Share Explanation

1. Dividend Payout Ratio measures the percentage of the company's earnings paid out as dividends.

HANMI Semiconductor Co's Dividend Payout Ratio for the quarter that ended in Mar. 2024 is calculated as

Dividend Payout Ratio=Dividends per Share (Q: Mar. 2024 )/ EPS without NRI (Q: Mar. 2024 )
=420/ 720.064
=0.58

During the past 13 years, the highest Dividend Payout Ratio of HANMI Semiconductor Co was 0.88. The lowest was 0.22. And the median was 0.40.

2. Dividend Yield % measures how much a company pays out in dividends each year relative to its share price.

HANMI Semiconductor Co Recent Full-Year* Dividend History

Amount Ex-date Record Date Pay Date Type Frequency Forex Rate
KRW 420.0000002024-03-062024-03-072024-03-29Cash DividendannuallyKRW:KRW 1.000000

* GuruFocus has an internal rule that if the most recent dividend payment frequency is at least 4 times a year, then the full year will be calculated according to the frequency of payment or the one-year time frame, whichever is stricter.
* GuruFocus converts dividend currency to local traded share price currency in order to calculate dividend yield. Please refer to the last column "Forex Rate" in the above table.


HANMI Semiconductor Co's Dividend Yield (%) for Today is calculated as

Dividend Yield %=Most Recent Full Year Dividend/Current Share Price
=420/148600.00
=0.28 %

Current Share Price is ₩148600.00.
HANMI Semiconductor Co's Dividends per Share for the trailing twelve months (TTM) ended in Today is ₩420.

During the past 13 years, the highest Dividend Yield of HANMI Semiconductor Co was 5.35%. The lowest was 0.26%. And the median was 2.55%.

Warning Sign:

HANMI Semiconductor Co Ltd stock dividend yield is close to 10-year low.

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


HANMI Semiconductor Co Dividends per Share Related Terms

Thank you for viewing the detailed overview of HANMI Semiconductor Co's Dividends per Share provided by GuruFocus.com. Please click on the following links to see related term pages.


HANMI Semiconductor Co (XKRX:042700) Business Description

Traded in Other Exchanges
N/A
Address
532-2 Gajwa-Dong, Seo-gu, Incheon, KOR, 404-250
HANMI Semiconductor Co Ltd operates in semiconductor equipment business. The company has the largest worldwide market share for sewing and placement system. Its product portfolio divides into three main segments: Semiconductor Equipment, Laser Application Processes, PV and LED. Semiconductor division offer equipment such as singulation, flip chip binder, molding, trim and form, marking, inspection, pick and place, attach and detach, and PCB equipment. Laser Application Processes comprises laser marking, laser ablation, laser cutting and singulation as well as reel to reel laser. PV and LED offer equipment including PV brick IR inspection, PV wafer inspection, LED manual mold, among others.

HANMI Semiconductor Co (XKRX:042700) Headlines

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