BE Semiconductor Industries NV (XAMS:BESI)
€ 133.35 2.4 (1.83%) Market Cap: 10.23 Bil Enterprise Value: 10.28 Bil PE Ratio: 59.80 PB Ratio: 21.31 GF Score: 85/100

BE Semiconductor Industries NV Capital Markets Day Transcript

Jun 06, 2023 / NTS GMT
Release Date Price: €99.96 (-1.95%)
Richard W. Blickman
BE Semiconductor Industries N.V. - Chairman of Management Board, President & CEO

This is the agenda for the presentations this afternoon: a small strategic overview by myself; market trends, Chris; wafer level assembly, Peter; and Christoph, die attach; Jeroen, packaging; and Bart, plating, followed by Q&A. Next slide, please. Let's hurry up a bit.

Hybrid bonding, that's what you all came for. Well, I hope you also came to see the other Besi products. But anyway, we're in the midst of a unique transition in this industry, where we see the hybrid bonding being adopted as the next mainstream technology for interconnect of single devices, but also organized in a chiplet architecture for dimensions, connected to below 5-nanometer chip design. And that is in the past 12 months since you were here. Already said, not anymore a question of whether this will come to the mainstream, but the question is only how fast and for which applications. So some of that, we will explain a bit more in Peter's presentation. But that's, of course, key.

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