Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the leading Cadence® Integrity™ 3D-IC platform has achieved certification for and met all reference design flow criteria for TSMC’s 3DFabric™ offerings, including Integrated Fan-Out (InFO), Chip-on-Wafer-on-Substrate (CoWoS®) and System-on-Integrated-Chips (TSMC-SoIC™) technologies. As part of the collaboration, the companies worked together to enable Cadence’s support of the TSMC 3DbloxTM standard to help customers accelerate advanced multi-die package design across 5G, AI, mobile, hyperscale computing and IoT applications.
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