BE Semiconductor Industries NV Capital Markets Day Transcript
This is the agenda for the presentations this afternoon: a small strategic overview by myself; market trends, Chris; wafer level assembly, Peter; and Christoph, die attach; Jeroen, packaging; and Bart, plating, followed by Q&A. Next slide, please. Let's hurry up a bit.
Hybrid bonding, that's what you all came for. Well, I hope you also came to see the other Besi products. But anyway, we're in the midst of a unique transition in this industry, where we see the hybrid bonding being adopted as the next mainstream technology for interconnect of single devices, but also organized in a chiplet architecture for dimensions, connected to below 5-nanometer chip design. And that is in the past 12 months since you were here. Already said, not anymore a question of whether this will come to the mainstream, but the question is only how fast and for which applications. So some of that, we will explain a bit more in Peter's presentation. But that's, of course, key.
Then you've also seen the first
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