Epoxy Base Electronic Material Co Ltd Stock Historical Dividends and Yields
Epoxy Base Electronic Material Co Ltd (SHSE:603002) pays a dividend yield of 0.08% ($0.01 per share annually). The payout ratio is 0.26. The 5-year dividend growth rate is -26.8%. Epoxy Base Electronic Material Co Ltd has been paying dividends since 2012.
Below is Epoxy Base Electronic Material Co Ltd's complete dividend history, ex-dividend dates, payout ratio trends, and dividend yield charts.
Dividend started since
Years of Dividend History
Years of No Dividend Reduction
Years of Dividend Increase
Dividend Yield
Dividend Payout Ratio
Growth Rate (5-Year)
Yield on Cost (5-Year)
3-Year Share Buyback Ratio
Dividend Growth
| Growth Rate | Yield on Cost | |
|---|---|---|
| 1 Year | -25% | 0.06% |
| 3 Year | -59% | 0.01% |
| 5 Year | -26.8% | 0.02% |
| 10 Year | 8.5% | 0.18% |
Epoxy Base Electronic Material Co Ltd Dividend History & Ex-Dividend Dates
Complete history of 15 dividend payments by Epoxy Base Electronic Material Co Ltd since 2012. Each row shows the ex-dividend date, amount per share, record date, pay date, and declaration date.
| Ex-Dividend Date | Amount | Record Date | Pay Date | Declaration Date |
|---|---|---|---|---|
| 2026-06-12 | CNY 0.015 | 2026-06-11 | 2026-06-12 | 2026-06-02 |
| 2025-06-13 | CNY 0.02 | 2025-06-12 | 2025-06-13 | 2025-06-03 |
| 2024-06-14 | CNY 0.05 | 2024-06-13 | 2024-06-14 | 2024-06-04 |
| 2023-06-15 | CNY 0.2 | 2023-06-14 | 2023-06-15 | 2023-06-05 |
| 2022-06-09 | CNY 0.29 | 2022-06-08 | 2022-06-09 | 2022-05-30 |
| 2021-06-16 | CNY 0.2475 | 2021-06-15 | 2021-06-16 | 2021-06-06 |
| 2020-06-09 | CNY 0.063 | 2020-06-08 | 2020-06-09 | 2020-05-30 |
| 2019-06-04 | CNY 0.041 | 2019-06-03 | 2019-06-04 | 2019-05-25 |
| 2018-06-08 | CNY 0.064 | 2018-06-07 | 2018-06-08 | 2018-05-29 |
| 2017-05-18 | CNY 0.022 | 2017-05-17 | 2017-05-18 | 2017-03-30 |
| 2016-06-17 | CNY 0.052 | 2016-06-16 | 2016-06-17 | 2016-04-14 |
| 2015-07-06 | CNY 0.031667 | 2015-07-03 | 2015-07-06 | 2015-04-16 |
| 2014-07-04 | CNY 0.034667 | 2014-07-03 | 2014-07-04 | 2014-04-18 |
| 2013-06-20 | CNY 0.024 | 2013-06-19 | 2013-06-26 | 2013-04-16 |
| 2012-11-09 | CNY 0.02 | 2012-11-08 | 2012-11-15 | 2012-09-07 |
Frequently Asked Questions: SHSE:603002 Dividend
What is Epoxy Base Electronic Material Co Ltd's (SHSE:603002) current dividend yield?
Epoxy Base Electronic Material Co Ltd (SHSE:603002) currently has a dividend yield of 0.08%, paying $0.01 per share annually. The forward yield is 0.08%.
What is Epoxy Base Electronic Material Co Ltd's payout ratio?
Epoxy Base Electronic Material Co Ltd's payout ratio is 0.26, which represents the percentage of earnings paid out as dividends. A lower payout ratio generally suggests more room for future dividend growth and greater safety during earnings downturns.
How long has Epoxy Base Electronic Material Co Ltd been paying dividends?
Epoxy Base Electronic Material Co Ltd has been paying dividends since 2012, a 14-year track record. The company has increased its dividend consistently since 2025.
Is Epoxy Base Electronic Material Co Ltd's dividend growing?
Epoxy Base Electronic Material Co Ltd's dividend has grown at an annualized rate of -26.8% over the past 5 years and 8.5% over the past 10 years. Dividend growth has been flat or negative recently.
Where can I see Epoxy Base Electronic Material Co Ltd's complete dividend data?
Above this section you'll find Epoxy Base Electronic Material Co Ltd's complete dividend payment history, ex-dividend dates, payout ratio trends, and yield charts. For broader analysis of Epoxy Base Electronic Material Co Ltd as an investment, visit the Epoxy Base Electronic Material Co Ltd Stock summary page on GuruFocus.
Dividend Yield History
Dividend Per Share History
Dividend Payout Ratio
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