Nexchip Semiconductor (SHSE:688249) Change In Payables And Accrued Expense : ¥0 Mil (TTM As of Mar. 2024)

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What is Nexchip Semiconductor Change In Payables And Accrued Expense?

Nexchip Semiconductor's Change In Payables And Accrued Expense for the quarter that ended in Mar. 2024 was ¥0 Mil. It means Nexchip Semiconductor's Accounts Payable & Accrued Expense stayed the same from Dec. 2023 to Mar. 2024 .

Nexchip Semiconductor's Change In Payables And Accrued Expense for the fiscal year that ended in Dec. 2023 was ¥0 Mil. It means Nexchip Semiconductor's Accounts Payable & Accrued Expense stayed the same from Dec. 2022 to Dec. 2023 .

Nexchip Semiconductor Change In Payables And Accrued Expense Historical Data

The historical data trend for Nexchip Semiconductor's Change In Payables And Accrued Expense can be seen below:

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Nexchip Semiconductor Change In Payables And Accrued Expense Chart

Nexchip Semiconductor Annual Data

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Change In Payables And Accrued Expense

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Nexchip Semiconductor Quarterly Data
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Nexchip Semiconductor Change In Payables And Accrued Expense Calculation

Change In Payables And Accrued Expense is the increase or decrease between periods of the Accounts Payable & Accrued Expense. Accrued expenses represent expenses incurred at the end of the reporting period but not yet paid; also called accrued liabilities. The accrued liability is shown under Liabilities section in the balance sheet.

Change In Payables And Accrued Expense for the trailing twelve months (TTM) ended in Mar. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was ¥0 Mil.

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Nexchip Semiconductor (SHSE:688249) Business Description

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Address

No. 88, West Feihe Road, Hefei Comprehensive Bonded Zone, Xinzhan District, Anhui Province, Hefei, CHN, 230011

Website

https://www.nexchip.com.cn

Nexchip Semiconductor Corp is the first 12-inch wafer foundry enterprise in Anhui Province. The company focuses on semiconductor wafer production and foundry services and is committed to contributing to the improvement of domestic independent and controllable integrated circuit manufacturing capabilities, providing customers with different 150-55nm process technologies, and will introduce more advanced process technologies in the future. It is engaged in Research and development, production and sales of integrated circuit-related products and supporting products.

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