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Micropac Industries (Micropac Industries) Debt-to-EBITDA : 6.31 (As of Feb. 2024)


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What is Micropac Industries Debt-to-EBITDA?

Debt-to-EBITDA measures a company's ability to pay off its debt.

Micropac Industries's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Feb. 2024 was $0.44 Mil. Micropac Industries's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Feb. 2024 was $15.21 Mil. Micropac Industries's annualized EBITDA for the quarter that ended in Feb. 2024 was $2.48 Mil. Micropac Industries's annualized Debt-to-EBITDA for the quarter that ended in Feb. 2024 was 6.31.

A high Debt-to-EBITDA ratio generally means that a company may spend more time to paying off its debt. According to Joel Tillinghast's BIG MONEY THINKS SMALL: Biases, Blind Spots, and Smarter Investing, a ratio of Debt-to-EBITDA exceeding four is usually considered scary unless tangible assets cover the debt.

The historical rank and industry rank for Micropac Industries's Debt-to-EBITDA or its related term are showing as below:

MPAD' s Debt-to-EBITDA Range Over the Past 10 Years
Min: 0.06   Med: 2.3   Max: 7.37
Current: 5.5

During the past 13 years, the highest Debt-to-EBITDA Ratio of Micropac Industries was 7.37. The lowest was 0.06. And the median was 2.30.

MPAD's Debt-to-EBITDA is ranked worse than
80.95% of 1743 companies
in the Hardware industry
Industry Median: 1.78 vs MPAD: 5.50

Micropac Industries Debt-to-EBITDA Historical Data

The historical data trend for Micropac Industries's Debt-to-EBITDA can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Micropac Industries Debt-to-EBITDA Chart

Micropac Industries Annual Data
Trend Nov14 Nov15 Nov16 Nov17 Nov18 Nov19 Nov20 Nov21 Nov22 Nov23
Debt-to-EBITDA
Get a 7-Day Free Trial Premium Member Only Premium Member Only - 0.06 0.81 3.79 7.37

Micropac Industries Quarterly Data
May19 Aug19 Nov19 Feb20 May20 Aug20 Nov20 Feb21 May21 Aug21 Nov21 Feb22 May22 Aug22 Nov22 Feb23 May23 Aug23 Nov23 Feb24
Debt-to-EBITDA Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 75.81 8.04 -12.58 1.93 6.31

Competitive Comparison of Micropac Industries's Debt-to-EBITDA

For the Electronic Components subindustry, Micropac Industries's Debt-to-EBITDA, along with its competitors' market caps and Debt-to-EBITDA data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Micropac Industries's Debt-to-EBITDA Distribution in the Hardware Industry

For the Hardware industry and Technology sector, Micropac Industries's Debt-to-EBITDA distribution charts can be found below:

* The bar in red indicates where Micropac Industries's Debt-to-EBITDA falls into.



Micropac Industries Debt-to-EBITDA Calculation

Debt-to-EBITDA measures a company's ability to pay off its debt.

Micropac Industries's Debt-to-EBITDA for the fiscal year that ended in Nov. 2023 is calculated as

Debt-to-EBITDA=Total Debt / EBITDA
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / EBITDA
=(0.432 + 15.316) / 2.137
=7.37

Micropac Industries's annualized Debt-to-EBITDA for the quarter that ended in Feb. 2024 is calculated as

Debt-to-EBITDA=Total Debt / EBITDA
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / EBITDA
=(0.436 + 15.212) / 2.48
=6.31

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

In the calculation of annual Debt-to-EBITDA, the EBITDA of the last fiscal year is used. In calculating the annualized quarterly data, the EBITDA data used here is four times the quarterly (Feb. 2024) EBITDA data.


Micropac Industries  (OTCPK:MPAD) Debt-to-EBITDA Explanation

In the calculation of Debt-to-EBITDA, we use the total of Short-Term Debt & Capital Lease Obligation and Long-Term Debt & Capital Lease Obligation divided by EBITDA. In some calculations, Total Liabilities is used to for calculation.


Be Aware

A high Debt-to-EBITDA ratio generally means that a company may spend more time to paying off its debt.

According to Joel Tillinghast's BIG MONEY THINKS SMALL: Biases, Blind Spots, and Smarter Investing, a ratio of Debt-to-EBITDA exceeding four is usually considered scary unless tangible assets cover the debt.


Micropac Industries Debt-to-EBITDA Related Terms

Thank you for viewing the detailed overview of Micropac Industries's Debt-to-EBITDA provided by GuruFocus.com. Please click on the following links to see related term pages.


Micropac Industries (Micropac Industries) Business Description

Traded in Other Exchanges
N/A
Address
905 East Walnut Street, Garland, TX, USA, 75040
Micropac Industries Inc manufactures and distributes a range of hybrid microelectronic circuits, solid-state relays (SSRs), power controllers, and optoelectronic components and assemblies. Its products are used as components in a range of military, space, and industrial systems, including aircraft instrumentation and navigation systems, power supplies, electronic controls, computers, medical devices, and high-temperature products. The company's core technology is the packaging and interconnecting of multi-chip microelectronics modules. Other technologies include light-emitting, and light-sensitive materials and products, including light-emitting diodes (LEDs) and silicon phototransistors used in the company's optoelectronic components and assemblies.
Executives
Mark W King director, officer: Chief Executive Officer 2905 WYNDHAM LANE, RICHARDSON TX 75082
Richard K Hoesterey director 7852 LA COSA DRIVE, DALLAS TX 75248
Eugene A. Robinson director 1200 LAKE POINT CIRCLE, MCKINNEY TX 75070
Heinz-werner Hempel director, 10 percent owner AM WALL 127 D-281951, BREMEN 2M 00000
Micropac Industries, Inc. 10 percent owner AM WALL 127 D-281951 1, BREMEN 2M 00000
Patrick Cefalu officer: CFO 8706 ARBORSIDE, ROWLETT TX 75089
Wood Connie J. director 877 FM 2948, COMO TX 75431
H. Kent Hearn director 1409 BRIAR HOLLOW, GARLAND TX 75043

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