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Unimicron Technology (TPE:3037) Forward PE Ratio : 0.00 (As of May. 13, 2024)


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What is Unimicron Technology Forward PE Ratio?

Unimicron Technology's Forward PE Ratio for today is 0.00.

Unimicron Technology's PE Ratio without NRI for today is 27.75.

Unimicron Technology's PE Ratio for today is 27.75.


Unimicron Technology Forward PE Ratio Historical Data

The historical data trend for Unimicron Technology's Forward PE Ratio can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Unimicron Technology Forward PE Ratio Chart

Unimicron Technology Annual Data
Trend 2018-12 2019-12 2020-12 2021-12 2022-12 2023-12 2024-01
Forward PE Ratio
23.98 17.15 19.65 23.81 6.05 13.55 12.24

Unimicron Technology Quarterly Data
2018-03 2018-06 2018-09 2018-12 2019-03 2019-06 2019-09 2019-12 2020-03 2020-06 2020-09 2020-12 2021-03 2021-06 2021-09 2021-12 2022-03 2022-06 2022-09 2022-12 2023-03 2023-06 2023-09 2023-12
Forward PE Ratio 20.96 20.12 25.06 23.98 34.72 19.61 17.99 17.15 11.20 15.41 14.53 19.65 18.83 24.39 18.02 23.81 19.69 10.83 5.92 6.05 7.51 16.58 13.95 13.55

Competitive Comparison of Unimicron Technology's Forward PE Ratio

For the Electronic Components subindustry, Unimicron Technology's Forward PE Ratio, along with its competitors' market caps and Forward PE Ratio data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Unimicron Technology's Forward PE Ratio Distribution in the Hardware Industry

For the Hardware industry and Technology sector, Unimicron Technology's Forward PE Ratio distribution charts can be found below:

* The bar in red indicates where Unimicron Technology's Forward PE Ratio falls into.



Unimicron Technology Forward PE Ratio Calculation

It's a measure of the price-to-earnings ratio (PE Ratio) using forecasted earnings for the calculation. While the earnings used are just an estimate and are not as reliable as current earnings data, there is still benefit in estimated P/E analysis. The forecasted earnings used in the formula can either be for the next 12 months or for the next full-year fiscal period.


Unimicron Technology  (TPE:3037) Forward PE Ratio Explanation

The Forward PE Ratio of a company is often used to compare current earnings to estimated future earnings, as well as gaining a clearer picture of what earnings will look like without charges and other accounting adjustments. If earnings are expected to grow in the future, the Forward PE Ratio will be lower than the current PE Ratio. This measure is also used to compare one company to another with a forward-looking focus.

Trailing PE Ratio relies on what is already done. It uses the current share price and divides by the total EPS (Basic) over the past 12 months. PE Ratio can be affected by Non Operating Income such as the sale of part of businesses. This may increase for the current year or quarter dramatically. But it cannot be repeated over and over. Therefore PE Ratio without NRI is a more accurate indication of valuation than PE Ratio .


Unimicron Technology Forward PE Ratio Related Terms

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Unimicron Technology (TPE:3037) Business Description

Traded in Other Exchanges
N/A
Address
No. 179, Shanying Road, Guishan District, Taoyuan, TWN
Unimicron Technology Corporation manufactures and distributes printed circuit boards and integrated circuit products. The company is based in Taiwan and earns its revenue in the Asia region, but also has operations in America and domestically within Taiwan. Unimicron manufactures printed circuit boards, multilayer chip scale packages, ball grid array, system in package, embedded passive products, super-thin substrate, and flip chip substrate, to be used in mobile devices, telecommunications applications, and laptop computers.

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