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China Wafer Level CSP Co (SHSE:603005) Interest Expense : ¥-14.8 Mil (TTM As of Mar. 2024)


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What is China Wafer Level CSP Co Interest Expense?

Interest Expense is the amount reported by a company or individual as an expense for borrowed money. China Wafer Level CSP Co's interest expense for the three months ended in Mar. 2024 was ¥ 0.0 Mil. Its interest expense for the trailing twelve months (TTM) ended in Mar. 2024 was ¥-14.8 Mil.

Interest Coverage is a ratio that determines how easily a company can pay interest expenses on outstanding debt. It is calculated by dividing a company's Operating Income(EBIT) by its Interest Expense. China Wafer Level CSP Co's Operating Income for the three months ended in Mar. 2024 was ¥ 58.1 Mil. China Wafer Level CSP Co's Interest Expense for the three months ended in Mar. 2024 was ¥ 0.0 Mil. GuruFocus does not calculate China Wafer Level CSP Co's interest coverage with the available data. The higher the ratio, the stronger the company's financial strength is. Note: If both Interest Expense and Interest Income are empty, while Net Interest Income is negative, then use Net Interest Income as Interest Expense.


China Wafer Level CSP Co Interest Expense Historical Data

The historical data trend for China Wafer Level CSP Co's Interest Expense can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

China Wafer Level CSP Co Interest Expense Chart

China Wafer Level CSP Co Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Interest Expense
Get a 7-Day Free Trial Premium Member Only Premium Member Only - - 51.24 -2.04 -10.25

China Wafer Level CSP Co Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
Interest Expense Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only - -14.82 - - -

China Wafer Level CSP Co Interest Expense Calculation

Interest Expense is the amount reported by a company or individual as an expense for borrowed money.

Interest Expense for the trailing twelve months (TTM) ended in Mar. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was ¥-14.8 Mil.

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


China Wafer Level CSP Co  (SHSE:603005) Interest Expense Explanation

Interest Coverage is a ratio that determines how easily a company can pay interest expenses on outstanding debt. It is calculated by dividing a company's Operating Income (EBIT) by its Interest Expense. The higher, the better.

Note: If both Interest Expense and Interest Income are empty, while Net Interest Income is negative, then use Net Interest Income as Interest Expense.

China Wafer Level CSP Co's Interest Expense for the three months ended in Mar. 2024 was ¥0.0 Mil. Its Operating Income for the three months ended in Mar. 2024 was ¥58.1 Mil. And its Long-Term Debt & Capital Lease Obligation for the three months ended in Mar. 2024 was ¥193.1 Mil.

China Wafer Level CSP Co's Interest Coverage for the quarter that ended in Mar. 2024 is calculated as

GuruFocus does not calculate China Wafer Level CSP Co's interest coverage with the available data.

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

The higher the ratio, the stronger the company's financial strength is.


China Wafer Level CSP Co (SHSE:603005) Business Description

Traded in Other Exchanges
N/A
Address
No.29 Tinglan Lane, Suzhou Industrial Park, Jiangsu Province, Suzhou, CHN, 215026
China Wafer Level CSP Co Ltd is a Chinese company engaged in offering semiconductor packages. It supplies wafer-level chip size packaging and test services to the RFID markets. The company also provides co-design and qualification services for new products. The company's product portfolio includes image sensor, biometric identification, ambient light, medical electronic and automotive sensor devices.
Executives
Qian Xiao Qing senior management
Wang Wei Directors, senior managers
Duan Jia Guo senior management
senior management
Yang Xing Xin senior management
Wang Zhuo Wei senior management

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