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Unimicron Technology (TPE:3037) LT-Debt-to-Total-Asset : 0.12 (As of Mar. 2024)


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What is Unimicron Technology LT-Debt-to-Total-Asset?

LT Debt to Total Assets is a measurement representing the percentage of a corporation's assets that are financed with loans and financial obligations lasting more than one year. The ratio provides a general measure of the financial position of a company, including its ability to meet financial requirements for outstanding loans. It is calculated as a company's Long-Term Debt & Capital Lease Obligationdivide by its Total Assets. Unimicron Technology's long-term debt to total assests ratio for the quarter that ended in Mar. 2024 was 0.12.

Unimicron Technology's long-term debt to total assets ratio increased from Mar. 2023 (0.12) to Mar. 2024 (0.12). It may suggest that Unimicron Technology is progressively becoming more dependent on debt to grow their business.


Unimicron Technology LT-Debt-to-Total-Asset Historical Data

The historical data trend for Unimicron Technology's LT-Debt-to-Total-Asset can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Unimicron Technology LT-Debt-to-Total-Asset Chart

Unimicron Technology Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
LT-Debt-to-Total-Asset
Get a 7-Day Free Trial Premium Member Only Premium Member Only 0.20 0.19 0.13 0.11 0.12

Unimicron Technology Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
LT-Debt-to-Total-Asset Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 0.12 0.11 0.11 0.12 0.12

Unimicron Technology LT-Debt-to-Total-Asset Calculation

Unimicron Technology's Long-Term Debt to Total Asset Ratio for the fiscal year that ended in Dec. 2023 is calculated as

LT Debt to Total Assets (A: Dec. 2023 )=Long-Term Debt & Capital Lease Obligation (A: Dec. 2023 )/Total Assets (A: Dec. 2023 )
=24806.806/216005.53
=0.11

Unimicron Technology's Long-Term Debt to Total Asset Ratio for the quarter that ended in Mar. 2024 is calculated as

LT Debt to Total Assets (Q: Mar. 2024 )=Long-Term Debt & Capital Lease Obligation (Q: Mar. 2024 )/Total Assets (Q: Mar. 2024 )
=27039.777/223096.366
=0.12

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Unimicron Technology  (TPE:3037) LT-Debt-to-Total-Asset Explanation

LT Debt to Total Asset is a measurement representing the percentage of a corporation's assets that are financed with loans and financial obligations lasting more than one year. The ratio provides a general measure of the financial position of a company, including its ability to meet financial requirements for outstanding loans. A year-over-year decrease in this metric would suggest the company is progressively becoming less dependent on debt to grow their business.


Unimicron Technology LT-Debt-to-Total-Asset Related Terms

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Unimicron Technology (TPE:3037) Business Description

Traded in Other Exchanges
N/A
Address
No. 179, Shanying Road, Guishan District, Taoyuan, TWN
Unimicron Technology Corporation manufactures and distributes printed circuit boards and integrated circuit products. The company is based in Taiwan and earns its revenue in the Asia region, but also has operations in America and domestically within Taiwan. Unimicron manufactures printed circuit boards, multilayer chip scale packages, ball grid array, system in package, embedded passive products, super-thin substrate, and flip chip substrate, to be used in mobile devices, telecommunications applications, and laptop computers.

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