What is Applied Micro Circuits Net Debt Paydown Yield %?
Net Debt Paydown Yield % is a metric that evaluates the total amount of debt a company has paid in relation to its market capitalization. It is a measure of a company's willingness and ability to reduce its debt.
As of today, Applied Micro Circuits's Net Debt Paydown Yield % was 0%.
Applied Micro Circuits Net Debt Paydown Yield % Historical Data
The historical data trend for Applied Micro Circuits's Net Debt Paydown Yield % can be seen below:
* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD. * For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.
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Applied Micro Circuits Net Debt Paydown Yield % Chart
Competitive Comparison of Applied Micro Circuits's Net Debt Paydown Yield %
For the Semiconductors subindustry, Applied Micro Circuits's Net Debt Paydown Yield %, along with its competitors' market caps and Net Debt Paydown Yield % data, can be viewed below:
* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.
Applied Micro Circuits's Net Debt Paydown Yield % Distribution in the Semiconductors Industry
For the Semiconductors industry and Technology sector, Applied Micro Circuits's Net Debt Paydown Yield % distribution charts can be found below:
* The bar in red indicates where Applied Micro Circuits's Net Debt Paydown Yield % falls into.
Applied Micro Circuits Net Debt Paydown Yield % Calculation
Applied Micro Circuits's Net Debt Paydown Yield % for the quarter that ended in Sep. 2016 is calculated as:
* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD. * For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.
* All the data are calculated by TTM values. Note that if a companies is traded in several exchanges, then we calculate the company level data for Net Debt Paydown Yield % using the primary share class stock data. The calculation result in definition page is for demonstration purpose only, and it's showing the share class level data. Therefore, the numbers in the calculation may differ from elsewhere if the stock is not a primary share.
Applied Micro Circuits (NAS:AMCC) Net Debt Paydown Yield % Explanation
Net Debt Paydown Yield % is the change in average of four quarters of company's total debt over a company's market cap. Assuming the total value of a company remains that same, shareholder value is increased as debt is reduced. In other words, it is a measure of the willingness and ability of a firm's management to pay down debt. Companies that have high debt paydown yields indicate that they are more aggressive with paying down debt.
In the calculation of Net Debt Paydown Yield %, we use the reductions of TTM average total debt one-year-ago and TTM average total debt at present, divided by its Market Cap.
Applied Micro Circuits Net Debt Paydown Yield % Related Terms
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Applied Micro Circuits (Applied Micro Circuits) Business Description
Applied Micro Circuits Corp was incorporated and commenced operations in California in 1979 and was reincorporated in Delaware in 1987. The Company is engaged in providing silicon solutions for next-generation cloud infrastructure and data centers, as well as connectivity products for edge, metro and long haul communications equipment. Its products include the X-Gene ARM 64-bit Server on a Chip solution, or X-Gene. The X-Gene family of products targets existing and emerging hyperscale cloud, scientific and high-performance computing and enterprise applications. It also offers embedded computing products based on Power Architecture, sometimes referred to as PowerPC products. The Company's HeliX family of embedded products is based on the ARM Instruction Set Architecture. The Company's embedded processor products are deployed in applications such as control- and data-plane management, wireless access points, residential gateways, wireless base stations, storage controllers, network attached storage, network switches and routing products, and multi-function printers. The Company's connectivity portion provides high-speed, high-bandwidth, high-reliability communications products. Its connectivity products include devices for Optical Transport Network (OTN) equipment and physical layer (PHY) devices that transmit and receive signals in a very high speed serial format. Its embedded computing products are deployed in applications in markets such as control- and data-plane functionality, wireless access points, residential gateways, wireless base-stations, storage controllers, network attached storage, network switches and routing products, and multi-function printers. The Company holds approximately 348 issued patents which cover aspects of the design and architecture of its integrated circuit ("IC") and enterprise storage products. The Company's registered trademarks include AppliedMicro, AMCC, APM, X-Gene, Server on a Chip, Cloud Server, OTNsec, Arming the Cloud and Hard Silicon, among others. It is subject to a variety of federal, state and local governmental regulations related to the use, storage, discharge and disposal of toxic, volatile or otherwise hazardous chemicals that were used in its manufacturing process.
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