VANCOUVER, British Columbia and AUSTIN, Texas, Jan. 06, 2023 (GLOBE NEWSWIRE) -- Inspire Semiconductor Holdings Inc. (TSXV: INSP) (“InspireSemi” or the “Company”), a chip design company that has built a technology foundation to deliver revolutionary performance, today announced that it has closed the first tranche of its previously announced non-brokered private placement (the “Financing”) of units (the “Units”) raising approximately 1/3 of the anticipated gross proceeds as previously announced by the Company in its press release dated December 7, 2022 (the “Financing Press Release”). As previously disclosed, each Unit being comprised of (i) an unsecured convertible debenture in a principal amount of C$1,000 and (ii) 52 proportionate voting share purchase warrants. The Company expects to close additional tranches of the Financing in Q1 2023. Please refer to the Financing Press Release for further information.
InspireSemi Announces Closing of First Tranche of Non-Brokered Private Placement of Units
Jan 07, 2023
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