TSMC (TSM) Advances in Panel-Level Chip Packaging Technology

Apr 15, 2025

TSMC (TSM, Financial) experienced a 1.12% increase, bringing its stock price to $157.59. According to recent reports, TSMC is nearing the completion of its research and development for panel-level advanced chip packaging (PLP). The company aims to start small-scale production around 2027. This new packaging technology is designed to accommodate the growing demand for more powerful artificial intelligence (AI) chips by utilizing square substrates that hold more semiconductors instead of traditional round substrates.

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