- Veeco Instruments (VECO, Financial) secures major wins for its Laser Spike Annealing Platform with two leading-edge logic manufacturers.
- High-volume manufacturing orders anticipated as customers escalate advanced node production.
- Veeco's strategic market expansion focuses on advanced semiconductor manufacturing applications.
Veeco Instruments Inc. (VECO) announced that its Laser Spike Annealing (LSA) Platform has been named the Production Tool of Record by two prominent logic manufacturers for their gate-all-around nodes. This selection signals significant market validation and positions Veeco to receive high-volume manufacturing orders as these customers advance their node production capabilities.
The LSA platform, lauded for delivering optimal annealing solutions in low thermal-budget applications, plays a critical role in front-end semiconductor manufacturing. It reduces resistance within transistor structures through millisecond annealing, effectively activating dopants while adhering to stringent thermal budgets necessary for advanced devices.
Veeco's technological portfolio, including the NSA500 system, broadens its annealing capabilities to encompass Backside Power Delivery and Contact Annealing for advanced nodes. These applications are pivotal in the enhancement of material properties such as void removal, recrystallization, and grain growth, which contribute to improved electrical performance of semiconductor devices.
This achievement underscores Veeco's strategy of expanding its Served Available Market by leveraging advanced technology investments and strategic collaborations with key logic manufacturers. This approach aligns with the industry's evolving requirements for precise annealing in next-generation semiconductor devices.
