- Synopsys (SNPS, Financial) and Intel Foundry collaborate on angstrom-scale chip designs using Intel 18A and 18A-P technologies.
- The partnership introduces production-ready EDA flows and the industry's broadest IP portfolio for advanced process nodes.
- Synopsys joins Intel Foundry Accelerator Design Services Alliance and Chiplet Alliance to enhance AI and HPC chip design capabilities.
Synopsys, Inc. (SNPS) and Intel Foundry have announced a strategic partnership aimed at advancing angstrom-scale chip designs using the Intel 18A and 18A-P process nodes. The collaboration leverages Synopsys' production-ready electronic design automation (EDA) flows and broad IP portfolio, ready for integration with Intel's latest semiconductor technologies.
This partnership includes the development of comprehensive digital and analog EDA flows certified for the Intel 18A process node, and production-ready for Intel 18A-P, featuring the RibbonFET Gate-all-around transistor architecture and PowerVia backside power delivery. These innovations are expected to significantly enhance the performance of next-generation artificial intelligence (AI) and high-performance computing (HPC) applications.
Synopsys is also focusing on enhancing multi-die design capabilities through Intel's Embedded Multi-die Interconnect Bridge-T (EMIB-T) advanced packaging technology, utilizing the Synopsys 3DIC Compiler. This approach aims to streamline the design process from exploration to signoff, facilitating complex system designs from smaller, specialized dies, a growing trend in semiconductor technology.
Furthermore, Synopsys is expanding its IP portfolio to include high-performance components like 224G Ethernet, PCIe 7.0, UCIe, USB4, and more. These are optimized for Intel's PowerVia technology, ensuring effective power distribution and enhancing overall chip performance.
By joining the Intel Foundry Accelerator Design Services Alliance and the Chiplet Alliance, Synopsys is cementing its position as a key player in Intel's ecosystem. This move aims to support the development and adoption of increasingly complex chip designs, as well as accelerate time-to-market for customers utilizing Intel's foundry services.
