- Ansys (ANSS, Financial) achieves certification for thermal and multiphysics signoff tools on Intel's 18A process technology.
- Collaboration extends to Intel Foundry's EMIB technology for 3D-IC systems.
- Ansys joins Intel Foundry Chiplet Alliance to enhance semiconductor system reliability.
Ansys (ANSS) has successfully obtained certification for its thermal and multiphysics signoff tools, RedHawk-SC, Totem, and HFSS-IC Pro, on Intel's advanced 18A process technology. These tools are essential for ensuring functionality and reliability in semiconductor systems, particularly for applications requiring AI chips, graphic processing units (GPUs), and high-performance computing (HPC).
The certification includes Ansys' collaboration with Intel Foundry on the Embedded Multi-Die Interconnect Bridge (EMIB) technology, which facilitates the creation of multi-die 3D integrated circuit (3D-IC) systems. Ansys provides comprehensive multiphysics signoff solutions, including its RedHawk-SC Electrothermal platform and SIwave package for electromagnetic simulation, to ensure thermal reliability and electromagnetic integrity in these advanced systems.
Expanding its industry footprint, Ansys has joined the Intel Foundry Chiplet Alliance, aiming to develop a secure ecosystem for interoperable chiplets. This strategic partnership is geared towards advancing the assembly of multi-die heterogeneous systems, which are increasingly crucial in semiconductor design efficiency and reliability.
In addition to the Intel 18A process, Ansys is also progressing with certification for the high-performance Intel 18A-P process node and collaborating on the Intel 14A-E process development through Design Technology Co-Optimization (DTCO). The company continues to innovate with tools like HFSS-IC Pro, certified for on-chip electromagnetic integrity, supporting advancements in telecommunications with capabilities for WiFi, 5G, and 6G technologies.
