Intel (INTC, Financial) recently hosted its Direct Connect event, focusing on its wafer foundry business. New CEO, Chen Liwu, assured industry clients of the company's commitment to enhancing its foundry operations. Intel unveiled its latest process roadmap, highlighting the 18A (1.8nm) process entering risk production, with mass production expected this year. The enhanced 18A-P variant has also begun early wafer production, and the 18A-PT process is planned for future development.
Intel's COO, Dr. Naga Chandrasekaran, showcased an 18A process wafer produced at the Oregon facility. In comparison, TSMC's 2nm (N2) process is anticipated to start mass production later this year, promising a 10%-15% performance boost and 25%-30% power reduction over the N3E process.
Intel also announced the next-generation 14A process, expected to enter risk production around 2027, offering a 15%-20% efficiency improvement and 1.3x chip density increase. Early clients have received 14A process kits, with interest in chip development at this new node. The 14A process will utilize ASML's high-NA EUV lithography, unlike TSMC's planned A14 technology for 2028.
Chen outlined four foundational goals for Intel's foundry business, emphasizing openness and standardization. The event also featured collaborations with Synopsys and Cadence, and a demonstration of a Boston Dynamics robot dog equipped with thermal cameras for factory inspections.
