- Smartkem (SMTK, Financial) partners with Manz Asia for advanced AI chip packaging solutions.
- Panel level packaging market projected to reach $600 million by 2030, with a 27% CAGR from 2024.
- Technological collaboration aims to overcome current wafer size limitations, enhancing throughput and reducing costs.
Smartkem (SMTK), a notable name in semiconductor material innovation, has announced a strategic collaboration with Manz Asia to pioneer advanced computer and AI chip packaging solutions. The partnership focuses on utilizing Smartkem's specialized inkjet printable dielectric layers to demonstrate large-area panel chip packaging. This initiative will be showcased at SEMICON® SEA 2025, scheduled from May 20-22 in Singapore.
The collaboration is a response to the rapidly growing panel level packaging market, which is expected to escalate to $600 million by 2030, supported by a robust 27% compound annual growth rate from 2024. The joint effort integrates Smartkem's UV curable dielectric chemistry with Manz Asia's high-precision inkjet printing technology, enabling scalable semiconductor packaging solutions that transcend traditional 300mm wafer constraints.
Panel level packaging offers significant advantages over conventional methods, most notably through its capacity for higher throughput and lower cost per chip. By facilitating the use of larger panel formats, this technology improves material utilization and integration capabilities, thereby supporting the escalating demands of AI and advanced computing.
The advanced packaging solutions aim to be a critical component in the development of AI infrastructure, enabling more efficient integration of complex chips without proportionate cost increases. The demonstration at SEMICON SEA will mark a pivotal moment for Smartkem and Manz Asia as they aim to capture a significant share of this burgeoning market segment.
