- Infineon and NVIDIA collaborate to create an 800 V power delivery architecture for AI data centers.
- This new system offers enhanced efficiency and reliability, supporting future AI workloads and higher power demands.
- Infineon leverages advanced semiconductor materials like Si, SiC, and GaN to enable this innovation.
Infineon Technologies AG (IFX / IFNNY) has unveiled a groundbreaking 800 V high-voltage direct current (HVDC) power delivery system in collaboration with NVIDIA, aimed at transforming power architecture for next-generation AI data centers. This move seeks to set a new industry standard by improving power distribution efficiency directly at AI chips or GPUs within server boards, maximizing energy efficiency and system reliability.
The innovation comes as AI data centers face increasing power demands, anticipating outputs of one megawatt (MW) per IT rack in the near future. The newly centralized HVDC architecture, paired with high-density multiphase solutions, addresses these challenges by optimizing energy consumption, supporting advanced AI infrastructures with improved scalability and performance.
Infineon, a leader in power semiconductor solutions, utilizes state-of-the-art materials such as silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) to expedite the transition to this efficient HVDC architecture. By minimizing power conversion stages, Infineon is paving the way for more effective power semiconductor integration in AI server racks, contributing to enhanced sustainability and operational efficiency in high-demand environments.
