- Silicon Labs (SLAB, Financial) introduces its first Series 3 SoCs with advanced 22nm technology, slated for Q3 2025 and beyond.
- SiXG301 optimizes line-powered devices, offering 4MB Flash and 512kB RAM, and supports multi-protocol operations.
- SiXG302 targets battery-powered devices with a 15 µA/MHz consumption, 30% lower than competitors, available for sampling in 2026.
Silicon Labs (SLAB), a leader in low-power wireless solutions, announced the launch of its Series 3 system-on-chip (SoC) families, SiXG301 and SiXG302, developed on the cutting-edge 22nm process node. This technological advancement marks a significant leap in power efficiency and integration for IoT devices.
The SiXG301 is specifically designed for line-powered applications, providing extensive support for multi-protocol operations across Zigbee, Bluetooth, and Matter over Thread networks. It features a robust memory capacity of 4MB Flash and 512kB RAM, positioning it as a future-proof solution as IoT protocol requirements expand. This SoC is expected to be generally available in the third quarter of 2025.
Meanwhile, the SiXG302 is engineered for battery-powered devices, boasting an impressive active current consumption of 15 µA/MHz, which is 30% lower than its competitors. This energy efficiency is crucial for prolonging battery life in IoT applications, with customer sampling anticipated to commence in 2026.
Both SoC families will offer "M" variants for multiprotocol operations (SiMG301/302) and "B" variants optimized for Bluetooth LE (SiBG301/302). These innovations cater to a broad spectrum of applications, including smart cities, industrial automation, healthcare, and smart homes.
With the Series 3 platform, Silicon Labs continues to drive IoT technological advancements, addressing the increasing demand for compact and efficient smart devices that do not compromise on performance or security.
