NVIDIA (NVDA, Financial) is collaborating with leading memory chip manufacturers Samsung, SK Hynix, and Micron (MICR) to develop a new memory module standard called SOCAMM (System On Chip Advanced Memory Module). This innovative module is designed to offer compact size and high performance, potentially entering mass production later this year after successful performance testing.
SOCAMM is anticipated to be a key component in NVIDIA's next-generation AI personal computer project, previewed at the 2025 CES event. This new module promises higher cost efficiency compared to traditional DRAMs utilizing SO-DIMM form factors. It incorporates LPDDR5X memory directly on the substrate, enhancing energy efficiency.
In terms of data transfer, SOCAMM surpasses LPCAMM and traditional DRAM modules with 694 I/O ports, compared to LPCAMM's 644 and DRAM's 260. The modular design allows easy upgrades and maintenance, with the module's size comparable to an adult's fingertip, offering greater flexibility for integration in laptops, AI devices, and embedded systems.
Details of the SOCAMM technology remain largely undisclosed, and notably, NVIDIA has opted to develop this new standard independently, without collaborating with JEDEC.
