- DuPont (DD, Financial) is showcasing its advanced interconnect solutions at the JPCA Show 2025 in Tokyo, focusing on AI and next-generation electronics.
- Featured products include Circuposit SAP8000 electroless copper for AI servers, Microfill acid copper solutions, and Riston dry film photoresists.
- DuPont's innovations support the growing demand for high-performance IC substrates, emphasizing improved data processing and thermal management capabilities.
DuPont (DD) announced its participation in the Total Solution Exhibition for Electronic Equipment 2025 (JPCA Show 2025) at the Tokyo Big Sight East Exhibition Halls from June 4-6. Visitors to Booth #6C-03 will see DuPont's extensive portfolio of advanced interconnect solutions, designed to enhance fine line, signal integrity, power, and thermal management in next-gen electronics.
Highlighting its advanced IC substrates, printed circuit boards (PCB), and packaging technologies, DuPont aims to address the burgeoning AI market. Key innovations include the Circuposit SAP8000 electroless copper, tailored for AI server CPUs and GPUs, promoting signal integrity at high frequencies. The Microfill acid copper solutions optimize plating for intricate chip architectures, addressing the semiconductor industry's shift toward heterogeneous integration and chiplet-based designs.
Additionally, DuPont will showcase its Riston DI1600 dry film photoresists, essential for high-resolution IC substrate applications, ensuring adhesion and high-yield performance. The Cyclotene dry-film photo-imageable dielectric offers efficient throughput and reliability for fan-out panel level packaging, essential for advanced computing applications.
The JPCA 2025 event underscores DuPont's half-century legacy in electronics innovation. By strategically aligning with high-growth segments of the semiconductor market, DuPont strives to empower advanced computing and connectivity, supporting the AI infrastructure with comprehensive solutions. The company's emphasis on materials that enhance fine line production, signal integrity, and thermal management positions it as a frontrunner in the rapidly evolving electronics industry.
