- Nordson Electronics Solutions collaborates with Powertech Technology, Inc. (PTI) to enhance semiconductor manufacturing processes.
- PTI reports underfill yields exceeding 99% using Nordsonās ASYMTEK VantageĀ® Dispensing system.
- The new solution reduces cycle time by nearly 30%, improving efficiency significantly.
Nordson Electronics Solutions has successfully partnered with Powertech Technology, Inc. (PTI) to develop an advanced panel-level packaging (PLP) solution, achieving underfill yields greater than 99% during semiconductor manufacturing. This collaboration marks a significant improvement in efficiency and manufacturing quality for PTI as they transition from wafers to panels in their operations.
The innovative solution involves Nordson's ASYMTEK VantageĀ® Series fluid dispensing system, equipped with the IntelliJetĀ® Jetting system, known for reducing underfill voids and decreasing cycle time by almost 30%. This technological advancement addresses the semiconductor industry's demand for advanced packaging solutions amid growing AI, high-performance computing (HPC), and chiplet-based architecture needs.
The PLP solution offers a path to efficiently manage larger die sizes and higher-density designs while maintaining cost-effectiveness, aligning with the industry's shift from 300-mm wafers to panels. PTI, a leading OSAT company, together with Nordson's applications team, has set up a comprehensive demonstration that achieved high-quality, void-free underfill results at scale.
Nordson Corporation (NDSN, Financial), recognized for its precision technology, continues to drive innovations that optimize fluid flow and mitigate warpage, ensuring reliable and efficient semiconductor packaging solutions. This development underscores Nordson's commitment to enhancing mechanical reliability and thermal performance in the semiconductor industry, an evolution from its earlier innovations in underfill processes for different applications, including PC boards, substrates, wafers, and now panels.
