- Coherent Corp. (COHR, Financial) introduces a diamond-silicon carbide composite with thermal conductivity over 800 W/m-K, doubling copper's effectiveness.
- The material aligns with the thermal expansion of silicon, ideal for semiconductor integration.
- This innovation promises substantial reductions in datacenter cooling costs, which can account for up to 50% of energy consumption.
Coherent Corp. (COHR), a leader in engineered materials, has launched a pioneering diamond-loaded silicon carbide (SiC) ceramic composite. This material is specifically designed to address the thermal management challenges in AI datacenters and high-performance computing (HPC) systems. With a thermal conductivity exceeding 800 W/m-K, it offers performance double that of traditional copper solutions.
The unique composite matches the coefficient of thermal expansion (CTE) of silicon, making it ideally compatible with semiconductor devices. This key characteristic allows for direct integration, potentially eliminating inefficiencies associated with intermediate thermal interface materials.
Coherent's new material stands out not only for its high thermal conductivity but also for being corrosion-resistant, electrically insulating, and mechanically robust. It is fully compatible with direct liquid cooling systems, ensuring the material's suitability for a range of cooling architectures.
Given the rising energy demands of AI computing infrastructure, where cooling can consume up to 50% of energy costs, Coherent's innovation is timely. The applications for this composite are vast, including chip heat spreading, microchannel cold plates, and semiconductor device substrates, positioning Coherent as a frontrunner in the thermal management sector.
