Current and historical daily PE Ratio for Chipbond Technology Corp (
ROCO:6147
) from 2002 to Sep 24 2024. The price to earnings ratio is calculated by taking the current stock price and dividing it by the most recent trailing twelve-month earnings per share (EPS) number. The data is updated every 20 minutes during market hours. The PE ratio can be viewed as the number of years it takes for the company to earn back the price you pay for the stock. Therefore, lower-P/E stocks are more attractive than higher P/E stocks so long as the PE ratio is positive. Also for stocks with the same PE ratio, the one with faster growth business is more attractive. Chipbond Technology stock (ROCO:6147) PE ratio as of Sep 24 2024 is 11.78.
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Chipbond Technology Corp (ROCO:6147) PE Ratio (TTM) Chart
Chipbond Technology Corp (ROCO:6147) PE Ratio (TTM) Historical Data
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| Chipbond Technology PE Ratio (TTM) Historical Data | |||
|---|---|---|---|
| Date | PE Ratio (TTM) Data | Date | PE Ratio (TTM) Data |
| 2024-09-24 | 11.8 | 2024-07-22 | 11.6 |
| 2024-09-23 | 11.8 | 2024-07-19 | 12.0 |
| 2024-09-20 | 11.8 | 2024-07-18 | 12.3 |
| 2024-09-19 | 12.0 | 2024-07-17 | 12.3 |
| 2024-09-18 | 11.9 | 2024-07-16 | 12.4 |
| 2024-09-16 | 12.0 | 2024-07-15 | 12.3 |
| 2024-09-13 | 11.8 | 2024-07-12 | 12.3 |
| 2024-09-12 | 11.8 | 2024-07-11 | 12.3 |
| 2024-09-11 | 11.6 | 2024-07-10 | 12.3 |
| 2024-09-10 | 11.6 | 2024-07-09 | 12.2 |
| 2024-09-09 | 11.9 | 2024-07-08 | 12.3 |
| 2024-09-06 | 11.7 | 2024-07-05 | 12.3 |
| 2024-09-05 | 11.9 | 2024-07-04 | 12.1 |
| 2024-09-04 | 11.8 | 2024-07-03 | 12.2 |
| 2024-09-03 | 12.0 | 2024-07-02 | 12.2 |
| 2024-09-02 | 12.2 | 2024-07-01 | 12.2 |
| 2024-08-30 | 12.1 | 2024-06-28 | 12.1 |
| 2024-08-29 | 11.9 | 2024-06-27 | 11.0 |
| 2024-08-28 | 11.9 | 2024-06-26 | 11.2 |
| 2024-08-27 | 11.9 | 2024-06-25 | 11.1 |
| 2024-08-26 | 11.8 | 2024-06-24 | 11.1 |
| 2024-08-23 | 11.8 | 2024-06-21 | 11.2 |
| 2024-08-22 | 11.8 | 2024-06-20 | 11.2 |
| 2024-08-21 | 11.8 | 2024-06-19 | 11.1 |
| 2024-08-20 | 11.9 | 2024-06-18 | 11.2 |
| 2024-08-19 | 11.9 | 2024-06-17 | 11.2 |
| 2024-08-16 | 11.8 | 2024-06-14 | 11.2 |
| 2024-08-15 | 11.7 | 2024-06-13 | 11.2 |
| 2024-08-14 | 11.8 | 2024-06-12 | 11.3 |
| 2024-08-13 | 11.7 | 2024-06-11 | 11.3 |
| 2024-08-12 | 11.8 | 2024-06-10 | 11.2 |
| 2024-08-09 | 11.6 | 2024-06-07 | 11.2 |
| 2024-08-08 | 11.5 | 2024-06-06 | 11.2 |
| 2024-08-07 | 11.6 | 2024-06-05 | 11.2 |
| 2024-08-06 | 11.1 | 2024-06-04 | 11.2 |
| 2024-08-05 | 11.2 | 2024-06-03 | 11.3 |
| 2024-08-02 | 11.7 | 2024-05-31 | 11.1 |
| 2024-08-01 | 11.8 | 2024-05-30 | 11.2 |
| 2024-07-31 | 11.5 | 2024-05-29 | 11.2 |
| 2024-07-30 | 11.7 | 2024-05-28 | 11.3 |
| 2024-07-29 | 11.7 | 2024-05-27 | 11.1 |
| 2024-07-26 | 11.3 | 2024-05-24 | 11.2 |
| 2024-07-25 | 11.6 | 2024-05-23 | 11.5 |
| 2024-07-24 | 11.6 | 2024-05-22 | 13.0 |
| 2024-07-23 | 11.6 | 2024-05-21 | 12.9 |
Chipbond Technology Corp (ROCO:6147) PE Ratio (TTM) Comparison
| Company | Market Cap(Mil) | PE Ratio (TTM) |
|---|
Business Description
Business Description
Chipbond Technology Corp
NAICS : 334413
SIC : 3674
ISIN : TW0006147002
Share Class Description:
ROCO:6147: Ordinary SharesDescription
Chipbond Technology Corp along is engaged in the research, development, manufacturing, and sale of driver IC and non-driver IC packaging and testing services. The products and services offered by the company include, Chip Tray, SiGe Wafer, SiC Wafer, Gold Bumping services, Packaging attachment services among others.
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