Techbond Group Bhd

NEW
XKLS:5289 (Malaysia)  
RM 0.28 +0.0050 (+1.85%) Jul 20
13.10
P/B:
0.78
Market Cap:
RM 208.64M ($ 51.01M)
Enterprise V:
RM 89.97M ($ 22.00M)
Volume:
238.00K
Avg Vol (2M):
244.40K
Trade In:
Volume:
238.00K
Avg Vol (2M):
244.40K

Techbond Group Bhd Stock Historical Dividends and Yields

Techbond Group Bhd (XKLS:5289) pays a dividend yield of 2.78% ($0.01 per share annually). The payout ratio is 0.38. The 5-year dividend growth rate is 12.3%. Techbond Group Bhd has been paying dividends since 2019.

Below is Techbond Group Bhd's complete dividend history, ex-dividend dates, payout ratio trends, and dividend yield charts.

Dividend started since

 
2019

Years of Dividend History

 
7

Years of No Dividend Reduction

 
1

Years of Dividend Increase

 
1
2.78% (Trailing)
6.48% (Forward)

Dividend Yield

0.38
 

Dividend Payout Ratio

12.3%
 

Growth Rate (5-Year)

4.97%
 

Yield on Cost (5-Year)

-12.7%
 

3-Year Share Buyback Ratio

* Special dividend is not included in the calculation of dividend per share and related fields

Dividend Growth


Growth Rate Yield on Cost
1 Year -46.7% 1.48%
3 Year 26% 5.56%
5 Year 12.3% 4.97%
10 Year 0% 2.78%

Techbond Group Bhd Dividend History & Ex-Dividend Dates

Complete history of 8 dividend payments by Techbond Group Bhd since 2019. Each row shows the ex-dividend date, amount per share, record date, pay date, and declaration date.

Techbond Group Bhd (XKLS:5289) Dividend History
Ex-Dividend Date Amount Record Date Pay Date Declaration Date
2025-12-05 MYR 0.0075 2025-12-08 2025-12-24 2025-11-21
2024-11-20 MYR 0.01 2024-11-21 2024-12-06 2024-11-06
2024-06-12 MYR 0.005 2024-06-13 2024-07-03 2024-05-27
2023-11-30 MYR 0.0075 2023-12-01 2023-12-15 2023-10-27
2022-12-29 MYR 0.005 2022-12-30 2023-01-17 2022-10-28
2021-09-10 MYR 0.005 2021-09-13 2021-09-30 2021-08-26
2020-12-21 MYR 0.004444 2020-12-22 2021-01-18 2020-11-25
2019-09-20 MYR 0.008889 2019-09-23 2019-10-10 2019-09-03

Frequently Asked Questions: XKLS:5289 Dividend

What is Techbond Group Bhd's (XKLS:5289) current dividend yield?

Techbond Group Bhd (XKLS:5289) currently has a dividend yield of 2.78%, paying $0.01 per share annually. The forward yield is 6.48%.

What is Techbond Group Bhd's payout ratio?

Techbond Group Bhd's payout ratio is 0.38, which represents the percentage of earnings paid out as dividends. A lower payout ratio generally suggests more room for future dividend growth and greater safety during earnings downturns.

How long has Techbond Group Bhd been paying dividends?

Techbond Group Bhd has been paying dividends since 2019, a 7-year track record. The company has increased its dividend consistently since 2025.

Is Techbond Group Bhd's dividend growing?

Techbond Group Bhd's dividend has grown at an annualized rate of 12.3% over the past 5 years and 0% over the past 10 years. This positive growth rate indicates consistent dividend increases.

Where can I see Techbond Group Bhd's complete dividend data?

Above this section you'll find Techbond Group Bhd's complete dividend payment history, ex-dividend dates, payout ratio trends, and yield charts. For broader analysis of Techbond Group Bhd as an investment, visit the Techbond Group Bhd Stock summary page on GuruFocus.

Dividend Yield History

MEDIUM Dividend Yield % : Close to 1-year low
This is the historical trailing annual dividend yield of Techbond Group Bhd. Buying stocks at higher yield relative its historical values is usually more profitable.

Dividend Per Share History

This the dividend history of Techbond Group Bhd

Dividend Payout Ratio

This is the historical payout ratio of Techbond Group Bhd. If the dividend payout ratio is close to or higher than 1, dividends might not be sustainable.