Techbond Group Bhd

NEW
XKLS:5289 (Malaysia)  
RM 0.28 (0%) Aug 20
13.33
P/B:
0.81
Market Cap:
RM 212.44M ($ 52.51M)
Enterprise V:
RM 93.77M ($ 23.18M)
Volume:
100.30K
Avg Vol (2M):
197.45K
Trade In:
Volume:
100.30K
Avg Vol (2M):
197.45K

Business Description

Description
Techbond Group Bhd is an investment holding company providing management services to its subsidiaries. Its segments are Industrial Adhesives & Sealants, Supporting Products and Services, and Chemicals, with the majority of revenue generated from Industrial Adhesives and Sealants. The company operates in Malaysia, Vietnam, Thailand, Indonesia, China, and other countries, with majority of revenue generated from Malaysia. It develops and manufactures water-based and hot melt adhesives, water-based and solvent-based sealants, and offers supporting products such as OEM adhesives, chemicals, repellents, cleaners, spare parts, and maintenance services. Its products include adhesives for woodworking, paper and packaging, mattresses, construction, hygiene, cigarettes, automotive, and bookbinding.
Name Current Vs Industry Vs History
Cash-To-Debt
9.92
Equity-to-Asset
0.9
Debt-to-Equity
0.05
Debt-to-EBITDA
0.5
Interest Coverage
40.85
Piotroski F-Score
5/9
0
1
2
3
4
5
6
7
8
9
Altman Z-Score
6.17
Distress
Grey
Safe
Beneish M-Score
-3.29
Manipulator
Not Manipulator
WACC vs ROIC
WACC
ROIC
Name Current Vs Industry Vs History
5-Day RSI
35.65
9-Day RSI
48.65
14-Day RSI
52.52
3-1 Month Momentum %
-1.79
6-1 Month Momentum %
-5.17
12-1 Month Momentum %
-11.29

Liquidity Ratio

Name Current Vs Industry Vs History
Current Ratio
9.65
Quick Ratio
8.09
Cash Ratio
6.75
Days Inventory
135.42
Days Sales Outstanding
64.41
Days Payable
22.6

Dividend & Buy Back

Name Current Vs Industry Vs History
Dividend Yield %
2.68
Dividend Payout Ratio
0.38
3-Year Dividend Growth Rate
26
Forward Dividend Yield %
6.25
5-Year Yield-on-Cost %
4.7
3-Year Average Share Buyback Ratio
-12.7
Shareholder Yield %
0.1

Financials

XKLS:5289's 30-Y Financials
Income Statement Breakdown FY
Not Enough Data
Balance Sheet Breakdown
Not Enough Data
Cashflow Statement Breakdown
Not Enough Data

Operating Revenue by Business Segment

Operating Revenue by Geographic Region

Historical Operating Revenue by Business Segment

Historical Operating Revenue by Geographic Region

5-Step DuPont Analysis as of
Not Enough Data

Guru Trades

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Insider Trades

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Peter Lynch Chart

Y-axis scale:
Interactive Chart
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Performance

Dividend
Log
Bar
To

Annualized Return %  

Symbol
1 Week
1 Month
3 Months
6 Months
YTD
1 Year
3 Years
5 Years
10 Years

Total Annual Return %  

Symbol
2026
2025
2024
2023
2022
2021
2020
2019
2018
2017

Techbond Group Bhd Executives

Details

Valuation Chart

Year:

Analyst Estimate

Key Statistics

Name Value
Revenue (TTM) (Mil RM) 129.574
EPS (TTM) (RM) 0.021
Beta 0.2027
3-Year Sharpe Ratio -0.42
3-Year Sortino Ratio -0.66
Volatility % 14.87
14-Day RSI 52.52
14-Day ATR (RM) 0.004461
20-Day SMA (RM) 0.27925
12-1 Month Momentum % -11.29
52-Week Range (RM) 0.26 - 0.33
Shares Outstanding (Mil) 758.7

Piotroski F-Score Details

Year:
Component Result
Piotroski F-Score 5
Positive ROA
Positive CFROA
Higher ROA yoy
CFROA > ROA
Lower Leverage yoy
Higher Current Ratio yoy
Less Shares Outstanding yoy
Higher Gross Margin yoy
Higher Asset Turnover yoy

Techbond Group Bhd Filings

Filing Date Document Date Form
No Filing Data

Techbond Group Bhd Stock Events

Financials Calendars
Event Date Price (RM)
MYR 0.007500 Cash Dividend 2025-12-05 0.32 (+0.00%)
MYR 0.010000 Cash Dividend 2024-11-20 0.41 (-1.22%)
2.25:1 Stock Split 2021-03-25 0.60 (-6.21%)
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Techbond Group Bhd Frequently Asked Questions

What is Techbond Group Bhd(XKLS:5289)'s stock price today?
The current price of XKLS:5289 is RM0.28. The 52 week high of XKLS:5289 is RM0.33 and 52 week low is RM0.26.
When is next earnings date of Techbond Group Bhd(XKLS:5289)?
The next earnings date of Techbond Group Bhd(XKLS:5289) is .
Does Techbond Group Bhd(XKLS:5289) pay dividends? If so, how much?
The  Dividend Yield %  of Techbond Group Bhd(XKLS:5289) is 2.68% (As of Today), Highest Dividend Payout Ratio of Techbond Group Bhd(XKLS:5289) was 0.46. The lowest was 0.22. And the median was 0.35. The  Forward Dividend Yield % of Techbond Group Bhd(XKLS:5289) is 6.25%. For more information regarding to dividend, please check our Dividend Page.

Press Release

Subject Date
No Press Release

Articles on Techbond Group Bhd

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