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3S Silicon Tech (ROCO:5297) Float Percentage Of Total Shares Outstanding : 0.00% (As of May. 30, 2024)


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What is 3S Silicon Tech Float Percentage Of Total Shares Outstanding?

Float percentage of total shares outstanding is the percentage of float shares relative to the total shares outstanding. As of today, 3S Silicon Tech's float shares is 0.00 Mil. 3S Silicon Tech's total shares outstanding is 37.15 Mil. 3S Silicon Tech's float percentage of total shares outstanding is 0.00%.

Insider Ownership is the percentage of shares that are owned by company insiders relative to the total shares outstanding. As of today, 3S Silicon Tech's Insider Ownership is 0.00%.

Institutional Ownership is the percentage of shares that are owned by institutions out of the total shares outstanding. As of today, 3S Silicon Tech's Institutional Ownership is 0.00%.

3S Silicon Tech Float Percentage Of Total Shares Outstanding Calculation

It is the percentage of float shares out of the total shares outstanding.

3S Silicon Tech's Float Percentage of Total Shares Outstanding for today is calculated as follows:

Float Percentage of Total Shares Outstanding=Float Shares/Total Shares Outstanding
=0.00/37.15
=0.00%

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

3S Silicon Tech (ROCO:5297) Business Description

Industry
GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » 3S Silicon Tech Inc (ROCO:5297) » Definitions » Float Percentage Of Total Shares Outstanding
Comparable Companies
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Traded in Other Exchanges
N/A
Address
Kangle Road, Xinfeng Township, 2nd Floor Number 169-2, Sec. 1, Hsinchu, TWN, 304
Website
http://www.sss-tech.com.tw
3S Silicon Tech Inc is a Taiwan based company involved in providing die bonding in discrete power devices. Its products include clip die bonder for power device, snap oven, customized equipment, and open lab platform.

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